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Sr. Detector​/Instrument Engineer

Job in Greenbelt, Prince George's County, Maryland, 20771, USA
Listing for: Columbus Technologies and Services
Full Time position
Listed on 2026-07-23
Job specializations:
  • Engineering
    Process Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 95000 - 140000 USD Yearly USD 95000.00 140000.00 YEAR
Job Description & How to Apply Below

Must be a US Person or Permanent Resident.

W2 with full benefits.

Customer and contract specific training will be required and provided.

Offer contingent on ability to successfully pass a background check and drug screen.

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position.

JOB DESCRIPTION
  • The Columbus Technologies & Services at NASA Goddard Space Flight Center seeks a talented microfabrication engineer to advance our cutting‑edge technology for internal projects. This exciting opportunity allows you to contribute directly to next‑generation space exploration capabilities.
  • Senior Detector/Instrument Engineer Oversees and directs activities associated with detector/instrument engineering.
  • Develop and optimize microfabrication processes for MEMS devices.
  • Troubleshoot process issues and implement solutions.
  • Collaborate with cross‑functional teams in design, test, and integration.
  • Document procedures and results according to industry standards.
  • Contribute to continuous improvement initiatives for fabrication processes.
REQUIRED SKILLS

Bachelor’s degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or related field; MS or PhD preferred.

Minimum 3 years of hands‑on experience in semiconductor or MEMS fabrication environments.

Demonstrated expertise in photolithography processes including photoresist application, exposure systems such as stepper tools or E‑beam lithography, and pattern development.

COMPREHENSIVE KNOWLEDGE OF THIN FILM DEPOSITION METHODS
  • Physical vapor deposition (thermal/e‑beam evaporation and sputtering)
  • Thermal oxidation processes
  • Atomic Layer Deposition (ALD)
  • Proficiency in etching techniques including:
  • Wet chemical etching of metals and dielectric films
  • Plasma‑based dry etching (RIE)
  • Deep Reactive Ion Etching (DRIE)
  • Specialty vapor phase etching (vapor HF and XeF2)
  • Experience operating metrology and characterization equipment:
  • Optical and electron microscopy
  • Ellipsometry for film thickness measurement
  • Stress measurement techniques for thin films
  • Electrical probing and device characterization
DESIRED SKILLS
  • Cleanroom experience in class 10‑1000 environments
  • Familiarity with process integration and optimization
  • Experience with Design of Experiments methodology
  • Knowledge of MEMS design principles and fabrication challenges
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