Senior NPI Packaging Engineer

Job Description

Job Purpose:

The Senior Packaging NPI Staff Engineer is responsible for leading Wafer-Level Chip-Scale Package (WLCSP) new product introduction activities from development through volume production. This role serves as the primary technical and program interface to customers, while coordinating cross-functional global teams to ensure successful execution of schedule, cost, quality, reliability, and cost objectives.

The position requires deep WLCSP technical expertise, strong customer-facing communication skills, and demonstrated experience in board-level reliability evaluation and failure analysis to support customer qualification and risk assessment.

• Own WLCSP package and process readiness from development through mass production.
• Define and control assembly flow, critical process parameters, materials,and reliability risks.
• Serve as final technical authority for WLCSP-related decisions impacting quality, yield, cost, and reliability.

• Own BLR test strategy definition, execution alignment, and technical interpretation.
• Lead failure mechanism identification, root cause analysis, and corrective action definition.
• Correlate package design, material properties, process variables, andPCB interactions to BLR performance.

• Act as primary customer-facing technical lead for WLCSP NPI and reliability topics.
• Host and lead customer technical reviews, BLR updates, and issue resolution meetings.
• Ensure customer confidence through clear communication, data-driven analysis, and timely follow-up.

• Coordinate global, cross-functional teams across engineering, QA, manufacturing, and supply chain.
• Drive alignment on schedule, deliverables, risk mitigation, and action closure.
• Escalate issues appropriately and facilitate resolution across organizational boundaries.

• Drive process optimization, yield improvement, and reliability enhancement initiatives.
• Capture and disseminate best practices, lessons learned, and technical standards.
• Mentor engineers and elevate overall WLCSP technical capability.

Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.

Typically 10+ years of experience in semiconductor packaging, with strong focus on WLCSP and board-level reliability.

Prior experience in NPI, package engineering, or customer-facing technical roles preferred.

Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world-leading MCUs, SoCs, analog and power products, plus Winning Combination solutions that curate these complementary products.

We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you.

Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements:
Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world.

Renesas is an embedded semiconductor solution provider driven by its Purpose ‘
To Make Our Lives Easier
.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial,…