Packaging Intern

Packaging Intern

Experience Level: Support Job Type: Intern

Location:

Greensboro, NC, US, 27409

Qorvo supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Qorvo's Internship Program is designed for college students currently enrolled in an accredited Bachelor's, Master's, or PhD program.

Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full-time opportunities, as available. Qorvo's Internship Program offers:
Challenging, skill-building assignments Mentoring and coaching from industry experts Launch & Learns and other learning opportunities Collaborative team-based work environment Networking and social events Final presentation to business leaders Qorvo's Packaging Engineering Internships are offered in our Global Operations business group. Specific projects and responsibilities will be determined based on the business needs at the time of the internship assignment.

Responsibilities may include:
Learn about Technology Development projects methodologies - to help and improve the process Learn about Design Rules and Assembly Process - Foster and mentoring Review Assembly and Marking diagram - look for opportunities to improve Material and BOM review and support of project deployment Onsite hands-on learning in semiconductor assembly processes Other minor activities related to documentation and continuous improvement (i.e. A3 documentation as part of Lean)

Qualifications:

BS in Materials Science or Mechanical Engineering Mechanical/Material Engineering skills Background with packaging materials (theoretical or practical). i.e. solder, epoxy, flux, mold compound preferred Background with assembly process (theoretical or practical). i.e. Wire Bond, Die Attach, Flip Chip preferred Experience using simulation software (i.e. ANSYS, COMSOL, Solid Work Simulation) is preferred Familiarity with automating simulation tasks using scripting or macros is preferred Communication and presentation skills Ability to manage and drive problem resolution Demonstrate strong analytical thinking skills 3.0 GPA or higher This position is not eligible for visa sponsorship by the Company.

Competitive hourly pay commensurate with experience: $31/hr - $42/hr (subject to change dependent on physical location) Posted salary ranges are made in good faith. Qorvo reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as external competitiveness and internal comparability. Base compensation is one element of Total Rewards offered e information on the Total Rewards package can be shared upon request.

Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.