Lead, Electrical Engineering - MEMS Subject Security Clearance

Position: Lead, Electrical Engineering - MEMS Subject with Security Clearance
L3

Harris is dedicated to recruiting and developing high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers' mission and quest for professional growth. L3

Harris provides an inclusive, engaging environment designed to empower employees and promote work-life success. Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do. L3

Harris is the Trusted Disruptor in defense tech. With customers' mission-critical needs always in mind, our employees deliver end-to-end technology solutions connecting the space, air, land, sea and cyber domains in the interest of national security.

Job Title:

Lead, Electrical Engineering - MEMS Subject Matter Expert Job Code: 37521

Job Location:

Herndon, VA

Job Schedule:

9/80:
Employees work 9 out of every 14 days - totaling 80 hours worked - and have every other Friday off

Job Description:

L3

Harris is seeking an accomplished MEMS Subject Matter Expert to lead our advanced microsystems technology initiatives and drive innovation in MEMS and Photonic Integrated Circuit (PIC) technologies. This senior technical leadership role offers an exceptional opportunity to shape the future of L3

Harris's microelectronics capabilities while leading our Herndon, VA Nanosystems team. The ideal candidate will combine deep technical expertise in MEMS design and fabrication as well as PIC microfabrication with proven business development skills and a passion for innovation. As a key technical leader, you will drive seedling and innovation IRAD projects, identify and capture new business opportunities, and provide strategic direction for our Nanosystems team and capabilities.

Essential Functions:

* Lead MEMS, Silicon Photonics, and PIC technology development from concept through demonstration, developing technology roadmaps and driving next-generation microsystems capabilities

* Identify and pursue new business opportunities in MEMS, Silicon Photonics and PIC technology areas, supporting proposal development and engaging with customers to capture new programs

* Provide technical leadership and subject matter expertise for complex MEMS design, modeling, and fabrication challenges across the organization

* Lead and mentor the Herndon, VA Nanosystems fabrication and design team, managing resource allocation, prioritization, and team capability development

* Direct microfabrication operations including cleanroom processes, equipment utilization, and process development activities to optimize throughput and quality

* Design and model MEMS devices for defense applications, conducting device characterization and performance validation

* Represent L3

Harris at technical conferences and customer meetings, building relationships with key customers and partners in MEMS/PIC technology areas

* Ability to obtain and maintain a TS/SCI clearance with CI polygraph

* Sit in Herndon, VA or potential to sit in Palm Bay, FL with significant travel to Herndon for team support

Qualifications:

* Bachelor's Degree and minimum 9 years of prior relevant experience. Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience. Preferred Additional

Skills:

* Active TS/SCI clearance

* Demonstrated expertise in MEMS device design, simulation, and microfabrication with a strong background in relevant processes (lithography, etching, deposition, bonding)

* Experience with cleanroom operations and semiconductor processing equipment

* Knowledge of Silicon Photonics and PIC technologies and photonic device design

* Proven track record of leading innovation projects and IRAD initiatives

* Business development experience with successful new business capture

* Experience with RF MEMS, optical MEMS, or inertial MEMS devices

* Knowledge of silicon photonics and integrated photonics platforms

* Familiarity with COMSOL, ANSYS, or other FEA/Multiphysics simulation tools

* Experience with MEMS design tools Understanding of packaging technologies for MEMS and photonic devices

* Publications or patents in MEMS or related fields

* Experience with wafer-level processing and 3D integration

* Knowledge of heterogeneous integration approaches

* Experience with DOD customers and defense applications In compliance with pay transparency requirements, the salary range for this role in Virginia - Greater Washington, D.C. area is $127,500- $236,500 . This is not a guarantee of compensation or salary, as final offer amount may vary based on factors including but not limited to experience and geographic location. L3

Harris also offers a variety of benefits, including health and disability insurance, 401(k) match, flexible spending accounts, EAP, education assistance, parental leave, paid time off, and company-paid holidays. The specific programs and options available to an employee may vary depending on date of hire, schedule type, and the applicability of collective…