APTM NPI Integrator

Job Details

Job Description: Intel is seeking an experienced APTM NPI (New Product Introduction) Integrator to lead technology transfer, manufacturing readiness, quality improvement, and yield optimization activities for advanced packaging and technology development programs. The successful candidate will drive the integration of new technologies into manufacturing by defining roadmaps, establishing operational strategies, and ensuring product and process readiness from startup through high-volume manufacturing.

This role requires deep manufacturing expertise, advanced data analytics capabilities, and strategic influence to accelerate technology deployment, improve manufacturing performance, and drive organizational excellence. We are seeking a highly motivated and technically skilled Integrator to lead the development and execution of new product/process introduction and process transfers across factories. The ideal candidate will play a key role in ensuring that technology, platforms, and products meet certification requirements before transferring to HVM.

• Logistical coordinator of introducing a new product into the factory by supplying the required process documentation to factory customers.
• Primary information interface between the fab and the upstream/downstream customers.
• Tracking collateral items, communicating wafer shipping to post‑fab customers, creating and updating the product codes in internal systems.
• Setting up lot flows, kicking off NPI checklists for each module, starting the silicon and monitoring its progress through the process flow for setup, power‑on and engineering samples until first production.
• Develop and implement new NPI systems and business processes as they become ready and close any issues identified in a NPI reflection.

• Candidates should have strong understanding of a product’s life cycle, fab processing, and post‑fab activities.
• Good understanding of key product/process development milestones.
• Experience managing NPI builds in factory environment, driving capacity execution efficiency.
• Quick learner, tracks issues and drives them to closure at all levels of the organization.
• Excellent verbal, written communication, and presentation skills.

Minimum Qualifications:

• BS or Master’s Degree in Chemistry, Mechanical, Materials Science, Electrical Engineering or related field.
• 2+ years of experience working with engineering fundamentals.

Preferred Qualifications:

• Process integration experience in integrating packaging processes with overall product manufacturing workflows.
• Package design experience meeting product specifications, regulatory requirements and customer needs.
• Previous related work experience in a semiconductor foundry.

Experienced Hire

Shift 1 (United States)

US, Oregon, Hillsboro

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs including health, retirement, and vacation. Annual salary range: $89,010.00 – $ USD.

Eligible for hybrid work model allowing employees to split time on-site and off-site. Job posting details subject to change.

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.