Director, Thin Film Development

Overview

Leads a team of thin film deposition engineers to drive technology development and enablement across multiple modules for advanced CMOS technologies. The role spans development and manufacturability across deposition processes (CVD, ALD, PVD, thermal/plasma deposition, epi, furnace, implant, anneal, and/or treatment). Primary responsibilities reside at the intersection of technology development and High Volume Manufacturing (HVM), driving safety, quality, performance, throughput, capability, defectivity reduction, uniformity, and cost improvement.

The leader will set goals, manage program deliverables, coach engineers, and develop an organizational strategy aligned to Intel foundry technologies roadmap; collaborate with TD, MDCE, and factory teams, and work with Integration and other module leaders to deliver modular solutions.

What we do:

As members of the Manufacturing Development and Customer Engineering (MDCE) team, we improve process capability for Intel s technology nodes from qualification to high volume manufacturing, delivering yield improvements, performance enhancements, and cost reductions across multiple technology nodes (including Intel 18A and Intel
3). The role partners with internal organizations and external suppliers to meet foundry customer needs on schedule.

• Strategic Alignment and Customer-first execution: align organizational goals with technical vision, formulate technical strategies, and execute to meet customer needs on time.
• Synthesis of diverse information: gather inputs and respond with appropriate strategic actions.
• Problem Solving: own the resolution of technical challenges and integrate solutions across multiple groups (TD and TFSM).
• Collaboration:
  
  work with TD, manufacturing, and business groups to achieve common goals.
• Stakeholder Engagement: interface with internal and external stakeholders (Integration, Device, Yield, Defect Metrology, Quality and Reliability, suppliers) and build strong relationships.
• Industry Trends: stay updated on relevant technologies and industry direction setting.
• Rapid Execution: conceptualize strategies and implement them swiftly to meet challenging schedules.
• Team management: define goals, remove roadblocks, ensure timely delivery of process solutions, own outcomes, and resolve issues quickly.
• Work in person with team members to enable faster decision making and problem resolution.

Minimum Qualifications:

• 14 years of relevant semiconductor experience with a strong focus on thin film deposition.
• Master s Degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or technical equivalent.
• 5+ years people management experience in large, multinational manufacturing settings, preferably in technology development.
• Strong history in process development, leadership, and semiconductor processes.
• Experience with investors and third-party suppliers to meet manufacturing needs, especially with leaders in thin film deposition (e.g., AMAT, LAM, ASM).
• Engineering group leader experience at global scale, including factory ramp-ups and process technology development in HVM.
• Extensive experience in fab start-up with track record across manufacturing engineering, quality/reliability, R&D, and supply chain innovations.

Preferred Qualifications:

• Doctoral degree is a plus.
• Substantial technical background in thin-film deposition for advanced CMOS, with research and patents.
• History delivering customized solutions in R&D and HVM organizations.
• Gate All Around (GAA) logic expertise.
• Cross-functional leadership experience.
• Previous semiconductor foundry experience preferred.

Job Type: Experienced Hire.

Shift: Shift 1 (USA). Primary

Location:

Hillsboro, Oregon; additional locations may apply.

We offer a competitive salary and benefits, including stock opportunities and comprehensive health plans. Find more information about Intel benefits.

Posting indicates Equal Employment Opportunity statements and that Intel Foundry employees are part of a global factory network. This role may require on-site presence. Intel is committed to responsible hiring practices and will not charge fees during the recruitment process.