Module Development Engineer; Adv Packaging

Position: Module Development Engineer (Adv Packaging)
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** Welcome!**## .Module Development Engineer (Adv Packaging) page is loaded## Module Development Engineer (Adv Packaging) locations:
US, Oregon, Hillsborotime type:
Full time posted on:
Posted Todayjob requisition :
JR0280767#
** Job Details:**##

Job Description:

The primary responsibilities for this role will include, but are not limited to:

Driving technology development enables both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.

Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.

Performs path-finding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmaps.

Recommends and implement modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.

Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.

Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.

Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.##
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* Qualifications:

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* Minimum Qualifications:

** The candidate must have bachelor’s degree in engineering, physics, chemistry or related STEM field with 5+ years of industry experience.
6+ months of experience with statistical controls6+ months of experience FMEA and/or DOE6+ months of semiconductor fabrication related experience    
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* Preferred Qualifications:

** Master’s degree in engineering, physics, chemistry or related STEM field with 4+ years of industry experience.

Ph.D. degree in engineering, physics, chemistry or related field

Preference for experience with dispense and/or material development.

Product ownership, change control management and data systems

Project management and delivering results for time critical technical projects.

Technical innovation and deliver results for complex, time critical technical projects.

Excellent verbal and written communication skills.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
** Interview Tips
** By applying to this posting your resume and profile will become visible to Intel Recruiters and will allow them to consider you for current and future job openings aligned with the skills and positions mentioned above.
** Posting Statement
** All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
** Benefits
* * We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits .o   
** Intel Benefits:
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** Life Inside Intel:
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** Interviewing Tips:**## Job Type:College Grad##

Shift: Shift 1 (United States of America)## Primary

Location:

US, Oregon, Hillsboro## Additional Locations:## Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our…