Process Engineer -IV

Position: Process Engineer I-IV
Job Description:

WORK STYLE DESIGNATION:
Hybrid (+50% Onsite)

WORK STYLE REQUIREMENT:
Onsite - 80% / Remote - 20%

WORK LOCATION:

NCP (Hillsboro, OR) Office

EXPECTED PAY RANGE: $64,811.80 - $ Annually

This pay range is for the position's base salary only. This position may be eligible for other compensation including incentive pay and/or allowances. Candidates will receive additional information during the interview and selection process.

JOB DESCRIPTION

SUMMARY:

The Process Engineer I - IV position is located in Hillsboro, OR and supports the business objectives of HTA's Semiconductor Equipment Division (SED) related to sales of Reactive Ion Etch (RIE or Plasma Etch) equipment to the semiconductor industry. This position's main objective is to provide process engineering support to SED's various cross-functional teams, demonstration labs, customer activities, and development programs.

The position will join one of two process engineering teams supporting advanced process nodes (2nm, 14A, 10A and beyond) in FEOL and BEOL dry etch modules.

* The Demo Team supports development of advanced dry etch processes that win customer tool-of-record selections by rapidly executing process development, optimization, and DOE-driven tuning to meet customer specifications, performance targets, and device integration requirements.

* The Productivity Team supports the ramp of advanced high-volume manufacturing (HVM) etch processes through development, sustaining, troubleshooting, and customer escalation support ensuring etch module performance meets productivity, defectivity, availability, and cost-of-ownership requirements.

PRIMARY RESPONSIBILITIES