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Silicon Packaging Design Intern — Test & Yield Focus

Job in Hillsboro, Washington County, Oregon, 97104, USA
Listing for: Intel Corporation
Apprenticeship/Internship position
Listed on 2026-06-03
Job specializations:
  • Engineering
    Electrical Engineering
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below

Intel Corporation in Hillsboro, Oregon, is seeking a Student Intern to support the development and maintenance of assembly design rules for advanced silicon packaging. You will assist in validating and testing silicon products and collaborating with cross‑functional teams to optimize product performance and improve yield.

The ideal candidate is pursuing a Master’s or PhD in Electrical Engineering or Computer Engineering, has experience with packaging assembly design, and is eager to work in a dynamic environment.

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