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Silicon Packaging Design Intern — Test & Yield Focus
Job in
Hillsboro, Washington County, Oregon, 97104, USA
Listed on 2026-06-03
Listing for:
Intel Corporation
Apprenticeship/Internship
position Listed on 2026-06-03
Job specializations:
-
Engineering
Electrical Engineering
Job Description & How to Apply Below
Intel Corporation in Hillsboro, Oregon, is seeking a Student Intern to support the development and maintenance of assembly design rules for advanced silicon packaging. You will assist in validating and testing silicon products and collaborating with cross‑functional teams to optimize product performance and improve yield.
The ideal candidate is pursuing a Master’s or PhD in Electrical Engineering or Computer Engineering, has experience with packaging assembly design, and is eager to work in a dynamic environment.
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