WLA Yield Defect Metrology Engineer

Overview

Inline Defect Metrology Engineer role within Advanced Packaging / TD s role focuses on process development, yield improvement, and data-driven decision making across technology nodes, with engagement across design, process, and manufacturing teams. The position requires regular onsite presence.

• Provide process development direction throughout the lifecycle of a technology node by identifying root cause yield limiters.
• Perform statistical analysis, develop visualizations and presentations to construct process development roadmaps that drive technology yield milestones.
• Develop methods, processes, and systems to consolidate and analyze diverse big data sources, establishing methodologies for defect mode understanding and yield modeling; lead yield Pareto construction and process roadmap definition.
• Organize, interpret, and structure insights from fab process, defect, and electrical data; detect data anomalies and drive process changes for yield enhancement.
• Extract insights from structured and unstructured data by synthesizing large data volumes using statistics, machine learning, and coding techniques.
• Transform complex experimental and manufacturing data into yield improvement actions using knowledge of product design and test features.
• Ensure manufacturability over process and product design through analysis of process and spec corners; collaborate with design to resolve yield issues before manufacturing ramp.
• Support new product introductions, enable design technology co-optimization, and participate in design of experiments in factory task forces.
• Foster cross-functional collaboration across organizations to debug yield limiters in design, test, and process development areas.
• Develop tools, multivariate algorithms, and methodologies for high-volume data analysis to identify root causes and recommend process changes for yield improvement.
• Perform fault isolation and failure analysis to determine root causes using tools such as ATE testing, DFx software, optical probing, circuit simulation, emulation, probing, and layout study.
• Develop measurement recipes to provide quick and accurate feedback on product integrity and address yield or quality issues.
• Develop and strengthen equipment to meet operational and capability needs for leading-edge logic nodes.

• Proactive and able to work in a dynamic, team-oriented environment.
• Enthusiastic collaborator and organizer; self-starter.
• Collaborative and interpersonal skills; able to influence and motivate others.
• Effective communication of technical concepts to both line and executive leadership.
• Model-based problem solving and root cause analysis skills.

• Minimum qualifications: Bachelor's degree in Materials Science and Engineering, Mechanical Engineering, Computer Information Systems, Computer Science, Information Systems, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or another STEM field, with 1+ years of relevant experience; OR Master’s degree with 6+ months of experience. Experience in metrology, yield/process improvement, or analytical tools (e.g., JMP, JSL, SQL/SQL Pathfinder).
• Other
  :
  This position is not eligible for Intel immigration sponsorship.

• Experience with Python for data analysis and process modeling.
• Detailed knowledge of substrate, assembly, and fab back-end processes.
• Ownership mindset and ability to collaborate with cross-functional partners to drive yield enhancement.
• Prior experience in defect reduction, yield analysis, or module engineering roles.

• Shift: Shift 7 (United States of America)
• Primary
  
  Location:
  
  US, Oregon, Hillsboro
• Job Type: Experienced Hire

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, ancestry, age, disability, or other protected characteristics. Intel is committed to responsible hiring practices. This posting and related information are subject to change.