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Packaging Engineer - Semiconductor Assembly & Sustainability
Job in
Hillsboro, Washington County, Oregon, 97104, USA
Listed on 2026-06-03
Listing for:
Intel
Full Time
position Listed on 2026-06-03
Job specializations:
-
Engineering
Packaging Engineer, Manufacturing Engineer
Job Description & How to Apply Below
Intel is seeking a Product Packaging Engineer to design and develop innovative packaging solutions that enhance product delivery globally. This role involves collaboration across manufacturing, regulatory, logistics, and supply chain teams to ensure sustainability and compliance.
Applicants should have at least a Bachelor’s degree in Engineering and significant experience in semiconductor packaging. The position offers competitive pay, benefits, and opportunities to influence Intel's packaging innovation.
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