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Silicon Product Engineering Graduate Intern

Job in Hillsboro, Washington County, Oregon, 97104, USA
Listing for: Intel
Apprenticeship/Internship position
Listed on 2026-06-04
Job specializations:
  • Engineering
    Electrical Engineering, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below

Responsibilities

Assist in the validation, debugging, and testing of silicon products, from initial bring-up to high-volume manufacturing.

Collaborate with cross-functional teams to resolve engineering challenges, optimize product performance, and improve yield and reliability.

Learn and apply principles of design for test (DFT), manufacturing (DFM), and debugging techniques to support product lifecycle and qualification.

Conduct root cause analysis and problem-solving to identify and address engineering issues effectively.

Contribute to the development and optimization of test engineering processes, tools, and documentation.

Support the analysis and optimization of power and performance metrics for silicon products.

Continuously build technical knowledge and skills through hands-on experience and collaborative projects.

Support development and maintenance of assembly design rules that addresses the capabilities and constraints of advanced silicon packaging and heterogeneous integration.

Contribute to package assembly design kit by creating and evaluating test cases for different assembly configurations.

Evaluate constraints arising from multidie integration, including flipchip, substrate routing, bump placements, and interconnect patterns, ensuring compliance with documented assembly rules.

Interpret design rule impacts on manufacturability, yield, and system-level integration requirements.

Assist in reviewing bump layouts and propose corrections across a design life cycle.

Prepare reports summarizing rule checks, violations, and recommendations, helping maintain an up to date, well organized assembly rule knowledge base.

Qualifications

Minimum Qualifications

  • Currently pursuing a Masters or PhD in Electrical Engineering, Computer Engineering, or a related field with a focus on semiconductor devices or silicon testing.
  • 3+ months experience with packaging assembly design.
  • Experience with root cause analysis and problem solving in a technical environment.
  • Familiarity with technical documentation and communication of engineering results.

Preferred Qualifications

  • Demonstrated ability to collaborate effectively with cross-functional teams in a research or engineering environment.
  • Knowledge of design for debug (DFD) principles and their applications in silicon validation.
  • Strong interest in continuous learning and improvement within the semiconductor domain.
  • Passion for making meaningful contributions to innovative technologies and products.
Job Details

Job Type: Student / Intern

Shift: Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro

Additional Locations: US, Arizona, Phoenix

Company

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers. We design, develop, manufacture, and assemble/test packages for compute devices to improve the lives of people on Earth.

Legal and Compliance

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, ancestry, age, disability, or any other characteristic protected by law.

Benefits:
We offer a total compensation package including competitive pay, stock bonuses, and benefits such as health, retirement, and vacation.

Work Model:
This role will require an on-site presence. Details are subject to change.

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