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Lead Die-to-Wafer Hybrid Bonding Engineer
Job in
Hillsboro, Washington County, Oregon, 97104, USA
Listed on 2026-06-05
Listing for:
Intel Corporation
Full Time
position Listed on 2026-06-05
Job specializations:
-
Engineering
Systems Engineer, Electrical Engineering
Job Description & How to Apply Below
Intel Corporation is seeking a Principal Engineer, Hybrid Bonding Module in Hillsboro, Oregon. In this role, you will define and scale advanced packaging technologies that enhance Intel's leadership in high-performance computing. Responsibilities include driving hybrid bonding technology and collaborating with vendors.
The ideal candidate has deep expertise in hybrid bonding process development, excellent communication skills, and the ability to mentor other engineers.
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