APTM Advanced Packaging Dry Etch Development Manager

** Welcome!**.APTM Advanced Packaging Dry Etch Development Manager page is loaded## APTM Advanced Packaging Dry Etch Development Manager locations:
US, Oregon, Hillsborotime type:
Full time posted on:
Posted Yesterday job requisition :
JR0283440#
** Job Details:**##

Job Description:

** The Role and Impact
** Intel Foundry is seeking an exceptional Advanced Packaging Dry Etch Module Development Manager to lead our plasma etch technology development for next-generation packaging solutions. This role will drive the development and implementation of dry etch processes critical to Intel's industry-leading advanced packaging portfolio, including Foveros Direct, Foveros, and EMIB (Embedded Multi-die Interconnect Bridge) technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in plasma physics and etch system optimization.

This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.

** Key Responsibilities**- Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment  - Formulate long-term strategies for process roadmap to meet future requirements, ensuring Intel remains a leader in advanced packaging  - Oversee development of production-worthy etch processes for high-volume manufacturing  - Foster talent development for critical technical roles, and drive technical excellence and innovation within the etch team  - Develop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross-functional teams  - Drive dry etch module and segment related yield improvement initiatives and defect reduction programs  - Partner with process integration, manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high-volume manufacturing
** The candidate should exhibit the following behavioral traits:**- Excellent communication and collaboration skills to drive complex projects across diverse teams and stakeholders.  - Strategic mindset with a proven ability to solve complex technical challenges and implement process improvements to achieve business objectives.##
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* Qualifications:

** Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates
** Minimum Qualifications**- Master or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.  - 10+ years of relevant experience with a master's degree, 8+ years or experience with a PhD degree.

The experience listed above should include a combination of the following qualifications:
* Plasma physics experience and hands-on experience working with various etch platform (ICP, CCP, RIE systems).
* Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.
* Experience in the semiconductor industry.
** Preferred Qualifications**- Demonstrated ability to build and lead effective teams, including fostering an inclusive, productive, and innovative team culture.  

- Experience with vendor relations, including material quality assessments and performance management.  - Strong knowledge of Design of Experiments (DOE) principles, problem-solving methodologies, and package interconnect technologies.
Join Intel and be a driving force in revolutionizing the future of semiconductor packaging. Apply today to inspire innovation and create a lasting impact.## Job Type:Experienced Hire##

Shift: Shift 1 (United States of America)## Primary

Location:

US, Oregon, Hillsboro## Additional Locations:## Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.

Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.## Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status,…