Senior Technologist, Hybrid Bonding Module

Job Details:

Job Description:

The Role and Impact

As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.

You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.

Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.

Key Responsibilities

* Drive process and/or equipment development for die-to-wafer hybrid bonding, including material selection, parameter optimization, equipment characterization, and process control.

* Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.

* Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.

* Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.

* Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.

* Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output.

* Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies.

* Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.

* Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement.

* Contribute to future technology roadmaps through evaluation of emerging hybrid bonding technologies.

Behavioral Skills

* Demonstrated ability to solve complex technical problems using structured engineering methodologies.

* Strong written and verbal communication skills with the ability to present technical findings to diverse audiences.

* Ability to influence and collaborate across cross-functional teams in technology development and manufacturing environments.

* Proven ability to mentor and develop engineers and technical team members.

* Demonstrated ability to manage multiple priorities and drive results in a fast-paced environment.

Qualifications:

Minimum Qualifications

* Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 9+ years of experience; OR

* Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 6+ years of experience; OR

* PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 4+ years of experience.

* 5+ years of industry experience in hybrid bonding, wafer bonding, advanced packaging, or closely related semiconductor manufacturing technologies.

Preferred Qualifications

* Experience leading first-of-a-kind (FOK) process or equipment development programs.

* Experience introducing new hybrid bonding platforms, manufacturing capabilities, or advanced packaging technologies.

* Knowledge of bond interface defect mechanisms, including void formation, adhesion challenges, contamination effects, and material interactions.

* Experience with alignment-sensitive manufacturing processes and overlay performance optimization.

* Experience with process characterization, metrology, defect inspection, or failure analysis techniques.

* Experience improving equipment capability, throughput, utilization, or process performance in a manufacturing environment.

* Experience collaborating with external equipment suppliers and materials vendors on technology development activities.

* Experience supporting technology transfer from development to manufacturing.

Job Type:

Experienced…