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Module Development Engineer; Adv Packaging

Job in Hillsboro, Washington County, Oregon, 97104, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-06-10
Job specializations:
  • Engineering
    Manufacturing Engineer, Process Engineer, Electrical Engineering, Materials Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
Position: Module Development Engineer (Adv Packaging)
## Module Development Engineer (Adv Packaging)
Apply locations:
US, Oregon, Hillsborotime type:
Full time posted on:
Posted Todayjob requisition :
JR0284566#
** Job Details:**##

Job Description:

** The Role and Impact
** This role is responsible for driving semiconductor technology development and manufacturing enablement for both high-volume manufacturing and next-generation technologies. The successful candidate will develop process integration and equipment solutions, conduct feasibility studies, and support the development of innovative device architectures and manufacturing technologies.

Working closely with internal engineering teams and external suppliers, this individual will lead process development efforts, optimize manufacturing capabilities, and contribute to technology roadmaps that enable future product requirements. This position requires regular onsite presence to support essential business and manufacturing activities.
** Key Responsibilities
*** Drive technology development and manufacturing enablement for current and future semiconductor technologies.
* Develop process integration and equipment solutions to meet device performance, quality, and manufacturability requirements.
* Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, metrology development, and system design.
* Perform process technology feasibility studies using engineering analysis, simulations, and experimental methods.
* Conduct pathfinding activities to support hardware and process development for emerging device architectures.
* Develop technology roadmaps that support future manufacturing and product requirements.
* Identify and implement process and equipment improvements to increase production efficiency, manufacturing capability, and overall output.
* Collaborate with equipment and material suppliers to develop and implement enabling technologies.
* Evaluate manufacturing trends, emerging technologies, and industry developments to identify opportunities for future process innovation.
* Partner with cross-functional teams to support technology transfer, process qualification, and manufacturing ramp activities.
** Behavioral Skills
*** Strong technical problem-solving and analytical skills.
* Ability to lead and influence cross-functional teams in a highly collaborative environment.
* Effective verbal, written, and presentation communication skills.
* Strong organizational skills with the ability to manage multiple priorities simultaneously.
* Demonstrated ability to drive results in fast-paced and technically complex environments.
* Ability to work independently while maintaining strong stakeholder alignment.
* Adaptability and willingness to learn new technologies, processes, and methodologies.##
*
* Qualifications:

*
* Minimum Qualifications:

* Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical discipline
* 1+ years of experience utilizing Statistical Process Control (SPC) and/or Design of Experiments (DOE) methodologies.

Preferred Qualifications:

* 1+ years of experience in semiconductor technology development.
* 1+ years of experience delivering results for complex, time-sensitive technical projects.
* 1+ years of experience with semiconductor fabrication processes and manufacturing technologies.
* Previous experience working in a semiconductor foundry or high-volume semiconductor manufacturing environment.## Job Type:College Grad##

Shift: Shift 1 (United States of America)## Primary

Location:

US, Oregon, Hillsboro## Additional Locations:## Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.

Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.## Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.## ## Position of Trust

N/A## Benefits We offer a total compensation package that ranks among the best in the…
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