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Senior Thin Films Engineer

Job in Hillsboro, Washington County, Oregon, 97104, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-06-23
Job specializations:
  • Engineering
    Manufacturing Engineer, Process Engineer, Electrical Engineering, Systems Engineer
Salary/Wage Range or Industry Benchmark: 133800 - 255200 USD Yearly USD 133800.00 255200.00 YEAR
Job Description & How to Apply Below

Overview

Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). It bridges the critical gap between Technology Development and High-Volume Manufacturing, advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.

About the Role

Join Intel's Manufacturing Development and Customer Engineering team as a Senior Engineer driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.

Key Responsibilities
  • Process Innovation & Excellence – Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules; drive defectivity reduction and uniformity improvements through systematic process enhancement; lead technical problem resolution and deliver solutions that meet aggressive technology node targets; optimize equipment performance working with internal teams and key suppliers.
  • Strategic Technical Leadership – Align technical vision with customer requirements and business objectives; synthesize complex technical data to formulate and execute strategic responses; own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines; deliver rapid execution of innovative solutions to meet challenging development timelines.
  • Cross-Functional Partnership – Collaborate closely with Technology Development, High-Volume Manufacturing, and Business Groups; build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers; present technical findings effectively to diverse audiences from engineering teams to executive leadership; foster in-person collaboration to accelerate decision-making and problem resolution.
  • Industry Leadership – Stay current with semiconductor industry trends and emerging process technologies; drive strategic initiatives that position Intel at the forefront of manufacturing innovation; contribute to technology roadmaps through hands-on technical expertise and market insight.
Qualifications
  • Minimum Qualifications:
    • Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or a STEM related field.
    • 5+ years semiconductor industry experience with strong focus on thin film deposition processes.
    • Proven experience in process development, technical leadership, and manufacturing engineering.
    • Extensive background working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization.
    • Comprehensive fab startup experience across manufacturing, quality, R&D, and supply chain functions.
    • Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems.
  • Preferred Qualifications:
    • Doctoral degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or a STEM related field with research publications and a patent portfolio in thin film technologies.
    • Expertise in Gate All Around (GAA) logic technologies within semiconductor foundry environments.
    • Proven track record delivering customized solutions across Technology Development and HVM organizations.
    • Cross-functional leadership experience managing diverse stakeholder groups.
    • Semiconductor foundry experience.
Employment Details

Job Type: Experienced Hire

Shift: Shift 1 (United States of America)

Primary

Location:

US, Oregon, Hillsboro

Additional Locations: US, Arizona, Phoenix

Business Group:
Intel Foundry

Compensation & Benefits

Annual Salary Range (US): $ – $ USD. The range represents the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Benefits include competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Work Model:
This role is eligible for a hybrid work model, allowing employees to split their time between working on-site at their assigned Intel site and off-site.

EEO Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Position Requirements
10+ Years work experience
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