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APTM NPI Integrator

Job in Hillsboro, Washington County, Oregon, 97104, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-06-23
Job specializations:
  • Engineering
    Manufacturing Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 99030 - 188890 USD Yearly USD 99030.00 188890.00 YEAR
Job Description & How to Apply Below

Job Overview

We are seeking a highly motivated and technically skilled Integrator to lead the development and execution of new product/process introduction and process transfers across factories. The Integrator will play a key role in ensuring that technology, platforms, and products meet certification requirements before transferring to HVM.

Responsibilities
  • Serve as the logistical coordinator of introducing a new product into the factory by supplying required process documentation to factory customers.
  • Act as the primary information interface between the fab and upstream/downstream customers.
  • Track collateral items, communicate wafer shipping to post‑fab customers, and create and update product codes in internal systems.
  • Set up lot flows, kick off NPI checklists for each module, start silicon, and monitor its progress through the process flow for setup, power‑on, and engineering samples until first production.
  • Develop and implement new NPI systems and business processes as they become ready and close any issues identified in a NPI reflection.
Behavioral Traits
  • Strong understanding of a product’s life cycle, fab processing, and post‑fab activities.
  • Good understanding of key product/process development milestones.
  • Experience working with and managing NPI builds in a factory environment.
  • Ability to drive capacity execution efficiency accordingly.
  • Quick learner, able to track issues and drive them to closure at all levels of the organization.
  • Excellent verbal and written communication, and presentation skills.
Minimum Qualifications
  • Bachelor’s Degree in Chemistry, Mechanical, Materials Science, Electrical Engineering, or a related field with 4+ years of experience working with engineering fundamentals; or
  • Master’s degree in the same fields with 3+ years of experience working with engineering fundamentals.
Preferred Qualifications
  • Experience in integrating packaging processes with overall product manufacturing workflows.
  • Experience designing packaging solutions that meet product specifications, regulatory requirements, and customer needs.
  • Previous related work experience in a semiconductor foundry.
EEO Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, sexual orientation, gender identity, gender expression, disability, national origin, age, or any other characteristic protected by law.

Salary Range

$99,030.00 – $ USD (US locations). Salary determined by work location and additional factors.

Work Model

This role is eligible for a hybrid work model, allowing employees to split their time between working on‑site at their assigned Intel site and off‑site.

Job Type and Locations

Experienced Hire. Shift
1. Primary location:
Hillsboro, Oregon (USA). Additional location:
Albuquerque, New Mexico (USA).

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