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Senior Silicon Photonics TD Reliability Engineer

Job in Hillsboro, Washington County, Oregon, 97104, USA
Listing for: Intel
Full Time position
Listed on 2026-06-26
Job specializations:
  • Engineering
    Quality Engineering, Electronics Engineer, Process Engineer, Research Scientist
Job Description & How to Apply Below

Job Details

Job Description:

Join Intel’s Silicon Photonics Q&R (SiPh) team that is in transformation and in its growing phase now, working to enable our internal leading edge SiPh photonics technology with integrated hybrid lasers and SOAs to our Intel Foundry customers. This is a unique opportunity to be part of the team that has propelled Intel to become a widely recognized leader in high-volume silicon photonics manufacturing and reliability.

Responsibilities
  • Assess intrinsic and extrinsic reliability of photonic devices and photonic ICs post fabrication and in integrated products form‑factories.
  • Work on process changes to optimize reliability.
  • Conduct DOEs to develop reliability models of the devices.
  • Develop new reliability characterization and acceleration techniques, analytical tools, and quality screens as required.
  • Determine requirements for both process certification and product qualification purposes.
  • Collaborate cross‑functional teams to drive the quality and reliability aspects of the SiPh technology development following Intel’s Development Life Cycle methodology.
  • Determine root causes/mechanisms of failures when encountered from reliability testing activities or customer returns as needed.
  • Review white papers and provide appropriate actions related to quality and reliability area.
  • Ensure smooth transition from development phase to HVM phase with proper quality systems, engineering shipment management, fab excursion support, and process change support.
Desired Behavioral Traits
  • Excellent communication skills (both verbal and written).
  • Strong networking, teamwork, and social skills.
  • Ability to work in a diverse and multi‑cultural team environment.
  • Work under pressure, and in an ever‑changing and dynamic environment.
  • Push forward multiple parallel efforts (multi‑tasking) in a constrained environment.
  • Strong problem‑solving skills.
  • Curious, eager, proactive, and quick to learn.
  • An independent thinker who can drive and develop solutions and implement them.
Key Technical Requirements
  • Usage of failure mode effects analyses and model‑based problem‑solving approaches.
  • Knowledge of statistics and data analysis, including advanced use of tools such as Excel, SAS and JMP for large data sets.
  • Skills to deliver concise key messages for senior management review.
  • Influencing cross‑functional teams to achieve extraordinary results.
  • Strong execution experience and commitment.
  • Passionate about quality and reliability as it relates to developing new technologies.
Education Requirement
  • PhD graduates with outstanding work in Photonics are encouraged to apply, or master’s in engineering or related field with 4+ years experience in photonic devices.
Minimum Qualifications
  • 2+ years of proven experience in Photonics devices development at a leading foundry, or 4+ year photonics experience from an academic institution.
  • 4+ year hands‑on compound semiconductor processing experience with deep knowledge of photonic device physics.
  • 4+ years of relevant engineering experience in Photonics with device characterization, yield, reliability, or test/validation experience.
Preferred Qualifications
  • PhD in Physics, Materials Science, Electrical Engineering, or related fields with 2+ years of experience in photonic devices.
  • 4+ years’ experience in process certification/product qualification and reliability risk assessment, quality systems, and quality culture knowledge.
  • Semiconductor device physics and defect mechanism knowledge.
  • Knowledge of semiconductor manufacturing processes, manufacturing process development, material characterization and development, and design validation.
  • Hands‑on semiconductor wafer fabrication process and process integration challenges.
  • Reliability failure statistics, physics, failure mechanisms, and failure analysis methodologies.
  • Experience in SPC/DOE principles, DOEs execution, and statistical analysis.
  • Data extraction and analysis skills (JMP/Crystal Ball/ILM/REL/PCS/SQL Scripting).
  • Experience in model‑based problem solving and familiar with other industry standard problem‑solving techniques (5 why’s, 8D).
  • Knowledge of photonic datacom and telecom reliability qualification standards such as Telcordia GR‑468, AEC‑Q102.
Job…
Position Requirements
10+ Years work experience
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