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Process Integration Engineer FE

Job in Hillsboro, Washington County, Oregon, 97104, USA
Listing for: Intel
Full Time position
Listed on 2026-06-27
Job specializations:
  • Engineering
    Process Engineer, Quality Engineering, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 90000 - 130000 USD Yearly USD 90000.00 130000.00 YEAR
Job Description & How to Apply Below
Position: Intel Process Integration Engineer - (FE)

Job Overview

Join Intel and build a better tomorrow. This role is part of the Intel Foundry MDCE and Logic Technology Development (LTD) organization, delivering process technology innovation for Intel's product roadmap.

Responsibilities
  • Process Flow Development
    • Develop and define integrated front-end process flows for new technology nodes.
    • Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, and metrology teams.
    • Establish process windows and integration schemes.
  • Yield and Defect Reduction
    • Analyze yield loss and parametric failures.
    • Perform root cause analysis using statistical tools such as SPC, DOE, and FMEA.
    • Drive corrective actions to improve yield and cycle time.
  • Device Performance Optimization
    • Ensure electrical parameters meet design targets.
    • Work closely with device engineers to tune process conditions.
    • Optimize critical dimensions (CD), overlay, and film thickness.
  • Process Control and Monitoring
    • Implement control plans and process monitoring strategies.
    • Use statistical tools such as Cpk/Ppk, control charts, and capability analysis.
  • Technology Transfer
    • Support ramp from R&D to high-volume manufacturing (HVM).
    • Document process specifications and SOPs.
  • Cross-Functional Collaboration
    • Device Engineering
    • Equipment / Module Engineering
    • Yield Engineering
    • Reliability Teams
    • Design Teams
Qualifications
  • Minimum Qualifications
    • PhD in Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering, Mechanical Engineering, or a related discipline.
    • At least 6 months experience in semiconductor device fabrication or nanotechnology, electrical characterization of transistors or other semiconductor devices, or clean room process development.
  • Preferred Qualifications
    • Experience with JMP, MATLAB, scripting languages (Python, JSL, TCL), or programming languages (SQL, C/C++).
    • Strong understanding of device physics (CMOS, FinFET, GAA, etc.).
    • Hands‑on experience in VLSI device fabrication and testing in the lab.
    • Knowledge of VLSI fabrication instruments (dry etcher, ALD, PE CVD, metallization, etc.).
    • Understanding of statistical process control, charting methodology, data flow and integrity; strong data analysis and presentation skills.
    • Integrated process knowledge, design‑of‑experiments and model‑based problem‑solving for complex problems and defects.
    • Knowledge of automation and defect classification systems in a fab environment.
    • Strong stakeholder management and influencing skills; experience coordinating with other departments and co‑workers.
Benefits
  • Competitive salary and financial benefits such as bonuses, life and disability insurance, and Intel stock options.
  • Health plans, wellness programs, and amenities.
  • Time off, recreational activities, and discounts on various products and services.
  • Other creative perks that make Intel a great place to work.
EEO Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, age, disability, veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by law.

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