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Intel Process Integration Engineer FE

Job in Hillsboro, Washington County, Oregon, 97123, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-06-27
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer, Quality Engineering, Electrical Engineering
Job Description & How to Apply Below
Position: Intel Process Integration Engineer - (FE)

Job Title

Join Intel and build a better tomorrow.

Job Description

The Intel Foundry MDCE and Logic Technology development (LTD) organizations delivers process technology innovation to drive Intel's product roadmap. We give you opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth. As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results.

We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation). We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work.

Job Responsibilities

1. Process Flow Development

  • Develop and define integrated front end process flows for new technology nodes.
  • Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, and metrology teams.
  • Establish process windows and integration schemes.

2. Yield and Defect Reduction

  • Analyze yield loss and parametric failures.
  • Perform root cause analysis using statistical tools (SPC, DOE, FMEA).
  • Drive corrective actions to improve yield and cycle time.

3. Device Performance Optimization

  • Ensure electrical parameters meet design targets.
  • Work closely with device engineers to tune process conditions.
  • Optimize critical dimensions (CD), overlay, and film thickness.

4. Process Control and Monitoring

  • Implement control plans and process monitoring strategies.
  • Use statistical tools such as:
    Cpk / Ppk, Control charts, Capability analysis.

5. Technology Transfer

  • Support ramp from RnD to high-volume manufacturing (HVM).
  • Document process specifications and standard operating procedures (SOPs).

6. Cross-Functional Collaboration/Work with

  • Device Engineering
  • Equipment Engineering/Module Engineering
  • Yield Engineering
  • Reliability Teams
  • Design Teams
Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Candidate must possess a PhD degree in one of these fields:
    Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering, Mechanical Engineering, or related discipline.
  • Candidate must possess at least one of the following: 6+ months experience on one or more of the following areas:
    • Semiconductor device fabrication or nanotechnology.
    • Electrical characterization of transistors or other semiconductor devices.
    • Clean room process development.

Preferred Qualifications:

  • JMP, MATLAB, Scripting languages (1.e. Python, JSL, TCL), or programming languages (1.e. SQL, C/C++).
  • Strong understanding of Device physics (CMOS, FinFET, GAA, etc).
  • Hand on experience in VLSI device fabrication and testing in the lab.
  • Knowledge of basic VLSI fabrication instruments (1.e. mechanism of dry etcher, ALD (atomic layer deposition), PE CVD, metallization, etc.)
  • Understanding statistical process control and charting methodology data flow and integrity. Strong data analysis and presentation acumen.
  • Integrated process knowledge, including strong design of experiments and model-based problem-solving skills for complex problems, excursions, and defects.
  • Knowledge of automation and defect classification systems in a fab environment.
  • Strong stakeholder management and influencing skills. Experience in coordination with other departments, co-workers, etc.
Job Type

College Grad

Shift

Shift 1 (United States of America)

Primary Location

US, Oregon, Hillsboro

Additional Locations

US, Arizona, Phoenix

Business Group

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology…

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