Senior Process Engineer - Dry Etch
Listed on 2026-07-01
-
Engineering
Manufacturing Engineer, Electrical Engineering, Process Engineer, Quality Engineering
Senior Process Engineer
- Dry Etch
Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.
Intel's Chandler, Arizona facility is constructing state-of-the-art fabrication facilities for cutting-edge technology nodes, including Intel 18A and beyond. Additionally, we're developing legacy technologies with foundry partners to launch HVM operations serving global foundry customers.
We seek an experienced Senior Process Engineer
- Dry Etch to join our MDCE team and help build a world-class Foundry Customer Engineering organization. This role focuses on Integration and Device engineering across various Intel technologies, including 18A, to serve our global foundry customer base. The position requires extensive hands-on experience with sub-3nm Gate-All-Around (GAA) FETs and front-end dry etch processing.
- Technology Development & Manufacturing
- Process Optimization & Innovation
- Industry Leadership & Strategic Vision
- Technical Leadership & Mentorship
This role involves close collaboration with Logic Technology Development (LTD) and Technology and Foundry Supply Manufacturing (TFSM) teams to support a comprehensive range of applications and customer requirements.
Qualifications:The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications- Bachelor's degree in Electrical Engineering, Physics, Material Science or in a STEM related field of study - 7+ years of hands-on experience in CMOS device engineering, device physics, logic architecture, and interconnect development on leading-edge nodes
- Direct etch experience in advanced CMOS device technology
- Knowledge of Design of Experiment (DOE) principles and engineering data analysis tools
- Semiconductor foundry experience
- Advanced degree (MS/PhD) in Electrical Engineering, Physics, Material Science or in a STEM related field of study
- Hands-on experience with sub-3nm Gate-All-Around (GAA) FETs
- Experience in ramp and high-volume manufacturing environments
- Experience with industry standards and certifications
- Experience with device parametric data generation and analysis
- Knowledge of Design of Experiment (DOE) principles and engineering data analysis tools
- Demonstrated success in foundry New Product Introduction (NPI) activities and complex tape-out troubleshooting
- Experience in product data interpretation, root cause analysis, and solution development
Intel offers an exceptional opportunity to work with cutting-edge technology in a collaborative and innovative environment. This position provides a unique platform to shape the future of Intel's semiconductor solutions while directly supporting the company's efforts to meet diverse industry needs and maintain leadership in high-volume manufacturing.
Join us in driving the next generation of semiconductor manufacturing excellence and advancing Intel's position as a global technology leader.
Job Type:
- Experienced Hire
Shift:
- Shift 1 (United States of America) Primary
Location:
- US, Oregon, Hillsboro Additional Locations:
- US, Arizona, Phoenix Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test…
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