Senior Silicon Packaging Design Engineer
Job in
Hillsboro, Washington County, Oregon, 97104, USA
Listed on 2026-07-01
Listing for:
Intel
Full Time
position Listed on 2026-07-01
Job specializations:
-
Engineering
Manufacturing Engineer, Electronics Engineer, Systems Engineer, Hardware Engineer
Job Description & How to Apply Below
Intel is seeking a motivated Silicon Packaging Design Engineer to enhance the design of silicon interposers at our Hillsboro location. The role involves designing physical layouts, optimizing performance, and collaborating with cross-functional teams.
A Bachelor’s degree or higher in a relevant field with demonstrated EDA tool proficiency is essential. With an annual salary range of $105,650 - $200,340, this position offers an opportunity to impact innovative technology.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
Search for further Jobs Here:
×