Module Development Engineer

Job Details:

Job title:

Module Development Engineer

As a Module Development Engineer, you will be integral to advancing Intel’s manufacturing processes and semiconductor technology. You will lead efforts in the development and optimization of cutting‑edge defect inspection tools and advanced manufacturing solutions. This role empowers you to influence high‑volume manufacturing, drive technology path‑finding initiatives, and shape the future of Intel’s industry‑leading innovations. Collaborating with key equipment and material suppliers, you will help develop solutions that align with Intel’s future roadmap, ensuring cost efficiency, scalability, and industry leadership.

• Design, develop, and optimize advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Lead feasibility studies and path‑finding activities to innovate device architectures and align with next‑generation roadmaps.
• Develop and implement defect inspection technologies for high‑volume manufacturing and future technology processes.
• Partner with equipment and material suppliers to implement enabling technologies that support Intel’s strategic goals.
• Recommend and execute modifications to improve equipment performance, optimize production efficiency, and enhance manufacturing techniques.
• Conduct process technology feasibility studies using theoretical simulations and practical engineering methods.
• Stay informed on industry trends and advancements to shape Intel’s semiconductor technology needs.
• Develop cost‑sensitive technology roadmaps by collaborating with vendors to push industry boundaries.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. This position is not eligible for Intel immigration sponsorship.

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, or STEM related field with 1+ years of relevant experience in semiconductor processing, system controls, opto‑mechanics, or mechanical systems.
• Technical expertise in semiconductor processing, system controls, opto‑mechanics, or mechanical systems.
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Programming experience in Python or MATLAB.
• Hands‑on experience with robotics, automation systems, vision systems, or image processing.

• Master’s degree or PhD in Mechanical Engineering, Electrical Engineering, or STEM related field.
• Experience in Advanced Packaging.
• Demonstrated ability to troubleshoot manufacturing processes and equipment.
• Experience with packaging processes, equipment automation development, or project management.
• Strong problem‑solving skills, adaptability, and ability to manage multiple tasks effectively.
• Passionate about contributing to Intel’s strategic advancements and driving meaningful industry innovation.

College Grad

Shift 1 (United States of America)

US, Oregon, Hillsboro

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about benefits of working at Intel.

US: $99,030.00– USD

This role will require an on‑site presence.