Chemical Mechanical Planarization; CMP Engineer

Shape the Future of Semiconductor Innovation at Intel Foundry

Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry.

MDCE is seeking a Staff Chemical Mechanical Planarization (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers.

Technical Leadership

• Process Development & Optimization:
  Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes
• Cross-Node Alignment:
  Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield
• Problem Resolution:
  Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies

Strategic Execution

• Customer-Centric Delivery:
  Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions
• Technology Transfer:
  Bridge technology development and manufacturing teams to ensure smooth transition of CMP processes to production
• Continuous Improvement:
  Drive ongoing optimization initiatives to enhance process capability, yield, and manufacturing efficiency

Collaboration & Leadership

• Cross-Functional Partnership:
  Work closely with Integration, Device, Yield, Factory, Quality, and Customer Engineering teams
• Supplier Engagement:
  Collaborate with equipment and consumables suppliers to co-develop and optimize CMP solutions
• Team Development:
  Mentor junior engineers and provide technical guidance across the organization

Professional Excellence

• Proven Track Record:
  History of significant technical accomplishments and successful project delivery
• Leadership Capability:
  Ability to influence and drive results across multiple organizations and disciplines
• Business Acumen:
  Understanding of semiconductor industry trends, manufacturing strategies, and customer requirements

Personal Attributes

• Communication
  
  Skills:
  
  Exceptional ability to communicate complex technical concepts to diverse audiences
• Adaptability:
  Thrives in ambiguous situations and can drive clarity in complex technical challenges while work effectively in fast-paced, high-pressure environments
• Initiative:
  Self-motivated with strong persistence and ability to work independently
• Quality Focus:
  Meticulous attention to detail with commitment to safety, quality, and compliance standards

The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
• 5+ years of experience in semiconductor manufacturing / process development or technology development
• 3+ years of direct experience in Chemical Mechanical Planarization (CMP) process development experience with hands-on process tuning and characterization
• Experience with major CMP equipment platforms in one of the following platforms (AMAT, Ebara, etc.)
• Experience with CMP consumables (e.g. slurries, pads, conditioning disks, filters, clean chemistries)
• Previous semiconductor foundry experience

Preferred Qualifications

• Doctorate in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
• Experience with advanced technology nodes (e.g. sub-10nm logic, specifically in Gate All Around (GAA) architectures with track record of successful technology development and HVM implementation
• Cross-functional leadership experience, including task force leadership for yield improvement initiatives
• Experience with CMP integration with other process modules (e.g. deposition, lithography, etch, clean) and CMP-relevant metrology with understanding of CMP impact on device performance and yield.
• Experience with CMP-relevant metrology and process control (e.g. thickness, topography, defects, roughness, particles)

Experienced Hire

Shift 1 (United States of America)

US, Oregon, Hillsboro