Advanced Packaging Lithography Development Manager

Advanced Packaging Lithography Module Development Manager

Intel Foundry is seeking an Advanced Packaging Lithography Module Development Manager to lead lithography development for next‑generation packaging solutions.

• Lead and manage a team of engineers, setting clear goals, managing performance, and coaching to foster a productive and innovative environment.
• Formulate long‑term strategies for the process roadmap to meet future requirements and maintain Intel’s leadership in advanced packaging.
• Foster talent development for critical technical roles and drive technical excellence and innovation within the etch team.
• Develop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross‑functional teams.
• Drive lithography module and segment–related yield improvement initiatives and defect reduction programs.
• Partner with process integration and manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high‑volume manufacturing.

• Excellent communication and collaboration skills to drive complex projects across diverse teams and stakeholders.
• Strategic mindset with a proven ability to solve complex technical challenges and implement process improvements to achieve business objectives.

• Master’s or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
• 6+ years of relevant experience with a master’s degree, or 5+ years of experience with a PhD degree.
• Experience should include a combination of the following:
• Equipment Mastery:
  Deep expertise with scanner/stepper systems (ASML, Canon, Nikon) and/or track equipment.
• Process Development:
  Extensive experience in lithography process optimization, yield enhancement, and/or manufacturing readiness.
• Project Management:
  Experience developing schedules, tracking deliverables, and managing cross‑functional collaborations.

• Demonstrated ability to build and lead effective teams, fostering an inclusive, productive, and innovative culture.
• Experience with vendor relations, including material quality assessments and performance management.
• Strong knowledge of Design of Experiments (DOE) principles, problem‑solving methodologies, and package interconnect technologies.

• Job Type: Experienced Hire
• Shift: Shift 1 (United States of America)
• Primary
  
  Location:
  
  US, Oregon, Hillsboro

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

We offer a total compensation package that ranks among the best in the industry. It includes competitive pay, stock bonuses, and benefit programs covering health, retirement, and vacation. The annual salary range for jobs which could be performed in the US is $– USD. The range displayed on this posting reflects the minimum and maximum target compensation for the position across all US locations;

individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training.

This role will require an on‑site presence.