Intel Process Integration Engineer FE Job Hillsboro area,Oregon USA,Engineering

Position: Intel Process Integration Engineer - (FE)

Job Details

Join Intel and build a better tomorrow.

Overview

What we do:

The Intel Foundry MDCE and Logic Technology development (LTD) organizations delivers process technology innovation to drive Intel’s product roadmap.

Benefits

We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation). We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, amenities, time off, recreational activities, discounts on various products and services, and many more creative rewards that make Intel a Great Place to Work.

Job Responsibilities

Process Flow Development

Develop and define integrated front end process flows for new technology nodes.
Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, and metrology teams.
Establish process windows and integration schemes.

Yield and Defect Reduction

Analyze yield loss and parametric failures.
Perform root cause analysis using statistical tools (SPC, DOE, FMEA).
Drive corrective actions to improve yield and cycle time.

Device Performance Optimization

Ensure electrical parameters meet design targets.
Work closely with device engineers to tune process conditions.
Optimize critical dimensions (CD), overlay, and film thickness.

Process Control and Monitoring

Implement control plans and process monitoring strategies.
Use statistical tools such as Cpk / Ppk, control charts, and capability analysis.

Technology Transfer

Support ramp from R&D to high‑volume manufacturing (HVM).
Document process specifications and standard operating procedures (SOPs).

Cross‑Functional Collaboration

Device Engineering
Equipment Engineering/Module Engineering
Yield Engineering
Reliability Teams
Design Teams

Qualifications

Minimum Qualifications:

Candidate must possess a PhD degree in one of the following fields:
Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering, Mechanical Engineering, or related discipline.
Candidate must possess at least one of the following:
- 6+ months experience on one or more of the following areas:
  - Semiconductor device fabrication or nanotechnology.
  - Electrical characterization of transistors or other semiconductor devices.
  - Clean room process development.

Preferred Qualifications:

JMP, MATLAB, scripting languages (e.g. Python, JSL, TCL), or programming languages (e.g. SQL, C/C++).
Strong understanding of device physics (CMOS, FinFET, GAA, etc).
Hands‑on experience in VLSI device fabrication and testing in the lab.
Knowledge of basic VLSI fabrication instruments (e.g. mechanism of dry etcher, ALD, PE CVD, metallization, etc.).
Understanding of statistical process control and charting methodology with strong data analysis and presentation acumen.
Integrated process knowledge, including strong design of experiments and model‑based problem‑solving skills for complex problems, excursions, and defects.
Knowledge of automation and defect classification systems in a fab environment.
Strong stakeholder management and influencing skills; experience in coordination with other departments, co‑workers, etc.

Additional Information

Annual Salary Range in the US: $ - $ USD. Compensation depends on location and experience. Work model requires on‑site presence. Intel does not charge recruitment fees. Candidates who are asked to pay any fees should report this immediately.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sexual orientation, gender identity, age, disability, veteran status, or any other characteristic protected by local law, regulation, or ordinance.

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