Senior Dry-Etch Process Engineer Advanced Packaging
Job in
Hillsboro, Washington County, Oregon, 97104, USA
Listed on 2026-07-14
Listing for:
Intel
Full Time
position Listed on 2026-07-14
Job specializations:
-
Engineering
Manufacturing Engineer, Process Engineer, Packaging Engineer
Job Description & How to Apply Below
Intel in Hillsboro, Oregon is seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The role focuses on developing, optimizing, and implementing dry etch processes for 2.5D/3D integration and chiplet packaging.
You will design experiments (DOE), partner with equipment suppliers, and drive roadmaps to meet future manufacturing needs while improving yield and efficiency.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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