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Senior Dry-Etch Process Engineer Advanced Packaging

Job in Hillsboro, Washington County, Oregon, 97104, USA
Listing for: Intel
Full Time position
Listed on 2026-07-14
Job specializations:
  • Engineering
    Manufacturing Engineer, Process Engineer, Packaging Engineer
Salary/Wage Range or Industry Benchmark: 133800 - 255200 USD Yearly USD 133800.00 255200.00 YEAR
Job Description & How to Apply Below
Position: Senior Dry-Etch Process Engineer for Advanced Packaging

Intel in Hillsboro, Oregon is seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The role focuses on developing, optimizing, and implementing dry etch processes for 2.5D/3D integration and chiplet packaging.

You will design experiments (DOE), partner with equipment suppliers, and drive roadmaps to meet future manufacturing needs while improving yield and efficiency.

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Position Requirements
10+ Years work experience
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