HBI Module Development Engineer

** Job Details:*
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* Job Description:

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* ** The Role and Impact*
* As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.

You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.

Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.

** Key Responsibilities*
* - Drive process and/or equipment manufacturing development for die-to-wafer hybrid bonding, including parameter optimization, equipment characterization, and process control.

- Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.

- Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.

- Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.

- Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.

- Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output.

- Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies.

- Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.

- Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement.

- Contribute to future technology roadmaps through evaluation of emerging hybrid bonding technologies.

** Behavioral Skills*
* - Demonstrated ability to solve complex technical problems using structured engineering methodologies.

- Strong written and verbal communication skills with the ability to present technical findings to diverse audiences.

- Ability to influence and collaborate across cross-functional teams in technology development and manufacturing environments.

- Proven ability to mentor and develop engineers and technical team members.

- Demonstrated ability to manage multiple priorities and drive results in a fast-paced environment.

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* Qualifications:

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* Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

** Minimum Qualifications*
* - Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 9+ years of industry experience;  
** OR*
* - Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 6+ years of industry experience;  
** OR*
* - PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 5+ years of industry experience.

Industry experience must include the following:

- 5+ years of industry experience in hybrid bonding, wafer bonding, advanced packaging,

** Preferred Qualifications*
* - Experience leading first-of-a-kind (FOK) process or equipment development programs.

- Experience introducing new hybrid bonding platforms, manufacturing capabilities, or advanced packaging technologies.

- Knowledge of bond interface defect mechanisms, including void formation, adhesion challenges, contamination effects, and material interactions.

- Experience with alignment-sensitive manufacturing processes and overlay…