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Hybrid Bonding Process Engineer - Lead FOK Development
Job in
Hillsboro, Washington County, Oregon, 97104, USA
Listed on 2026-07-18
Listing for:
Intel Corporation
Full Time
position Listed on 2026-07-18
Job specializations:
-
Engineering
Process Engineer
Job Description & How to Apply Below
Intel Corporation in Hillsboro, Oregon is seeking an experienced engineer to lead advanced hybrid bonding process development for die-to-wafer integration. You will optimize parameter sets, improve yield and defectivity, and drive robust process control across manufacturing stations.
The role requires strong communication, mentorship, and cross-functional collaboration to advance technology readiness and contribute to future roadmaps in a fast-paced environment.
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