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Senior Architect, Die-to-Wafer Hybrid Bonding
Job in
Hillsboro, Washington County, Oregon, 97104, USA
Listed on 2026-07-20
Listing for:
Dormont Manufacturing Co
Full Time
position Listed on 2026-07-20
Job specializations:
-
Engineering
Systems Engineer
Job Description & How to Apply Below
Dormont Manufacturing Co is seeking a Principal Engineer for Die-to-Wafer Hybrid Bonding in Hillsboro, Oregon. This pivotal role involves defining and scaling advanced packaging technologies, directly impacting Intel’s roadmap in performance and cost efficiency.
Your expertise will drive the development of hybrid bonding capabilities, involving collaboration across technologies and mentoring future leaders. A degree in relevant engineering fields and significant industry experience in hybrid bonding is essential. Join us for a challenging, impactful role!
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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