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Senior Silicon Packaging & Test Board Design Lead
Job in
Hillsboro, Washington County, Oregon, 97104, USA
Listed on 2026-08-03
Listing for:
Intel
Full Time
position Listed on 2026-08-03
Job specializations:
-
Engineering
Electronics Engineer, Test Engineer -
Design & Architecture
Job Description & How to Apply Below
Intel in the United States is seeking an experienced Silicon Packaging Design Engineer to lead end-to-end test board development, from concept through tapeout, ensuring manufacturable PCB designs that meet electrical, mechanical, performance, and cost objectives.
The candidate will collaborate with package design, test vehicle design, validation, and lab teams to optimize board requirements and package-board interactions, with strong emphasis on signal integrity, DFM/DFX, and design rule
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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