Principal Engineer, Module Development – CMP

Principal Engineer, Module Development – CMP

Intel

Location

Hillsboro, OR

Type

Full-time

Posted

8/5/2026

Compensation

$211,400 - $298,440 per year

Undergraduate with 5+ Years of Experience

Approval 96.6%

The Principal Engineer, Module Development role at Intel focuses on leading Chemical Mechanical Planarization (CMP) process development and optimization across advanced logic technologies. This position is part of the Manufacturing Development and Customer Engineering (MDCE) team, which aims to enhance process capability and ensure high-quality silicon delivery. The successful candidate will collaborate with various teams to resolve complex manufacturing issues and drive robust CMP solutions.

This role requires a blend of technical expertise, strategic thinking, and leadership skills.

• Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field;
  PhD preferred.
• 15+ years of relevant experience in semiconductor manufacturing, process development, or technology development.
• 10+ years of direct experience in Chemical Mechanical Planarization (CMP) process development and optimization, including hands‑on process tuning and characterization.
• Proven experience with CMP equipment and consumables, including at least one major CMP tool platform and associated materials/components.
• Demonstrated ability to perform structured, data-driven root-cause analysis.

• Lead CMP module development strategy and execution across multiple technology nodes.
• Own technical direction for CMP process optimization, qualification, and high-volume manufacturing readiness.
• Drive defect reduction, yield improvement, and process stabilization initiatives.
• Partner with integration, device, yield, factory, and customer engineering teams to resolve complex technical and manufacturing issues.
• Develop and implement solutions that align module performance across technology development and manufacturing environments.
• Lead cross-functional problem-solving efforts related to excursions, variability reduction, and process integration.
• Engage with internal and external stakeholders, including suppliers, to co-develop and optimize CMP processes and consumables.
• Provide technical leadership in process control, metrology, and module interaction impacts on device performance and yield.
• Mentor junior engineers and act as a technical focal point for CMP within the module and program.
• Communicate technical findings, status, and recommendations clearly to leadership and stakeholders.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.

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• New hires 632
• FY 2025