Thin Films Module Development Engineer
Listed on 2026-08-24
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Engineering
Process Engineer
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Job Description:
••••
• Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role you will be responsible for delivering metals process definition, development, and optimization in metal deposition modules.
Core Responsibilities:
- Primary ownership of thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related process platforms
- Design, implement, and optimize processes to meet specifications for materials, device performance, yield, and process control
- Design, execute, and analyze experiments to meet integrated device requirements and support rapid yield improvement
- Apply expert knowledge of equipment operating principles, materials characteri...
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
- PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field
With at least 1+ years of experience in:
- Working knowledge of one or more thin film deposition technologies such as ALD, CVD, PVD, sputtering, evaporation, electrochemical deposition, or related vacuum process technologies
- Demonstrated ability to analyze process data using statistical methods, structured troubleshooting, and robust experimental design
Preferred Qualifications:
- Experience in thin film metal deposition process development for high-k/metal gate stack, contact metallization, or Cu interconnect barrier/liner/plating
- Experience with materials characterization and metrology methods such as XRF, XPS, XRD, SEM, TEM, ellipsometry, e-test, defect inspection, reliability, and related techniques
- Experience with MOSFET / FinFET / GAA / CFET device characteristics, electrical characterization techniques, and semiconductor device fundamentals
- Proficient with data analysis software including JMP, Excel, Python, R, SQL
- Strong communication and collaboration skills with demonstrated ability to solve challenging and ambiguous technical problems in a fast-moving and dynamic team environment
- Experience using AI-assisted engineering tools to improve technical productivity while maintaining critical independent engineering judgement
- Strong written and verbal communication skills with ability to document decisions, summarize technical data, and align cross-functional stakeholders
- Availability to work on site and support 24/7 manufacturing operations with on-call rotation
Job Details:
••••
• Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role you will be responsible for delivering metals process definition, development, and optimization in metal deposition modules.
Core Responsibilities:
- ...
Qualifications:
Minimum qualifications ...
Minimum Qualifications:
- PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field
With at least 1+ years of experience in:
- Working knowledge ...
- Demonstrated ability ...
Preferred Qualifications:
- ...
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Job Type:
College Grad
Shift:
Shift 1 (United States of America)
Primary
Location:
US, Oregon, Hillsboro
Posting Statement:
All qualified applicants will receive…
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