Module Development Defect Inspection Engineer

Module Development Defect Inspection Engineer

Full time
· US, Oregon, Hillsboro

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Join our Advanced Packaging Technology and Manufacturing team as a Module Development Engineer, Defect Inspection, where you will help enable next-generation semiconductor innovation. In this role, you will develop, optimize, and scale defect inspection solutions that support both current high-volume manufacturing (HVM) and future technology nodes.

You will collaborate across engineering, suppliers, and research teams to improve inspection capability, drive yield improvements, and influence future process technologies.

• Develop and implement defect inspection and metrology technologies for semiconductor manufacturing.
• Design and optimize processes, inspection methods, and equipment performance.
• Conduct process experimentation and feasibility studies using statistical and engineering methods (DOE, SPC).
• Collaborate with equipment and materials suppliers to introduce new technologies.
• Analyze defect data to identify root causes and improve yield and quality.
• Drive continuous improvement of inspection systems through automation, software, and hardware enhancements.
• Support technology pathfinding and roadmap development for next-generation products.
• Stay current with industry trends, emerging tools, and inspection methodologies.

• Collaborate effectively across teams and disciplines
• Show curiosity and continuous learning mindset
• Demonstrate strong analytical and problem-solving skills
• Can adapt to changing priorities in a dynamic environment
• Communicate technical concepts clearly to diverse audiences
• Take ownership and accountability for results
• Drive innovation while maintaining attention to detail

• Work on cutting-edge semiconductor technologies
• Opportunity to influence high-volume manufacturing and future nodes
• Collaborative, inclusive, and innovation-driven environment
• Career growth through challenging technical opportunities
• invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.
  • See Benefits for more details.

Bachelor’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related field + 4 years of experience. Or a Master's degree in the same field with 3+ years of experience and a PhD in the same field with 2+ years of experience.

Your experience described above must be in the following:

• Semiconductor processing, system controls, opto-mechanics, or mechanical systems.
• Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

• Demonstrated ability to troubleshoot manufacturing processes and equipment.
• Experience with packaging processes, equipment automation development, or project management in technology development.
• Previous related work experience in a semiconductor foundry preferred

We invite you to bring your expertise and creativity to , where you will have the opportunity to innovate, collaborate, and shape the future of semiconductor technology.

Experienced Hire

Shift 1 (United States of America)

US, Oregon, Hillsboro

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

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We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more…