Senior Architect, Semiconductor Packaging
Job in
Hillsboro, Washington County, Oregon, 97104, USA
Listed on 2026-09-07
Listing for:
Intel Corporation
Full Time
position Listed on 2026-09-07
Job specializations:
-
Engineering
Job Description & How to Apply Below
Intel Corporation in Oregon seeks a Silicon Packaging Architect to lead end-to-end package solutions that meet electrical, thermal, and cost targets. You will drive design through production readiness, troubleshoot issues, and work with silicon, hardware, and manufacturing teams to ensure smooth tape-out transitions.
The role requires advanced degrees and 9+ years hands-on experience (or 6+ with masters, 4+ with PhD), expertise in DFM and DOE, and ability to guide cross-functional teams in a
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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