Process Technician – TEM​/Metrology – Night Shift

Process Technician – TEM / Metrology – Night Shift

Location:

Hillsboro, OR 97124 Work Arrangement: 100% Onsite

Shift: Night Shift – Compressed Work Schedule

Hours:

40 hours per week

Employment Type:

W-2 Contract Assignment Dates:
September 8, 2026 – September 7, 2027 Openings: 2 Industry: Semiconductor / Advanced Manufacturing

We are seeking a hands-on Process Technician – TEM / Metrology to support semiconductor process engineering and metrology operations in Hillsboro, OR.

This position performs technical tests and experiments, operates advanced metrology and microscopy equipment, collects and analyzes test data, and works closely with engineering teams to troubleshoot and optimize semiconductor manufacturing processes.

This is a night-shift position that typically works a compressed schedule. Candidates must be comfortable working overnight hours in a semiconductor manufacturing environment.

• Perform technical tests and experiments in support of Process Engineering.
• Set up and operate metrology and supporting laboratory/process equipment.
• Operate advanced metrology tools including TEM, Dual Beam SEM/FIB, light microscopes, sputtering/deposition equipment, and related tools.
• Prepare records, charts, graphs, and other documentation of test and experimental results.
• Support equipment and process qualification activities.
• Adjust hardware and software parameters to execute experiments and correct process issues.
• Work closely with engineering teams to troubleshoot process and equipment problems.
• Perform minor electrical and mechanical troubleshooting.
• Perform preventative and unscheduled maintenance on process equipment.
• Assist engineers with process-related diagrams, graphs, and technical data.
• Document procedures and assist with the development of training materials.
• Follow established semiconductor manufacturing, equipment, and safety procedures.
• Wear required Personal Protective Equipment (PPE).

• High school diploma or equivalent required; AA/AS, bachelor's, or advanced education may also be considered.
• Strong mechanical aptitude and hands-on technical skills.
• Ability to troubleshoot basic mechanical and electrical equipment issues.
• Strong problem-solving and communication skills.
• Ability to work independently and collaborate with engineering teams.
• Proficiency with Microsoft Office applications, including Excel, Word, PowerPoint, Outlook, and Access.
• Manual dexterity and ability to safely work with precision equipment.
• Ability to work a compressed night-shift schedule.

The client prefers candidates with approximately 3–4 years of semiconductor processing experience, particularly within a high-volume manufacturing environment; however, this level of experience is not required.

Relevant backgrounds may include:

• Semiconductor manufacturing
• Semiconductor process technology
• Metrology
• TEM / Transmission Electron Microscopy
• SEM / Scanning Electron Microscopy
• FIB / Focused Ion Beam
• Dual Beam SEM/FIB
• Thin-film deposition
• Etch processes
• Wafer fabrication
• Process equipment
• Equipment maintenance or troubleshooting
• Laboratory or materials characterization

Knowledge or experience with EDS, EELS, PEELS, and STEM is highly desirable.

• Ability to safely lift and carry objects weighing up to 35 pounds.
• Ability to perform hands-on technical work requiring manual dexterity.
• Ability to sit for extended periods when operating or monitoring equipment.
• Must follow semiconductor industry safety procedures and properly use required PPE.
• Occasional travel to training facilities or customer locations may be required.

The strongest candidate will have a combination of hands-on technical ability, mechanical aptitude, semiconductor or metrology exposure, and troubleshooting experience.

Direct TEM/SEM/FIB experience is highly relevant, but candidates with broader semiconductor processing, equipment, thin-film, etch, microscopy, or metrology backgrounds should also be considered.