Process Improvement Engineer; Group MLB TE Job Houston area,Texas USA,Manufacturing / Production

Position: Process Improvement Engineer (A Group MLB TE 02 )

Process Improvement Engineer (A Group MLB TE 02 )

Purpose of the position Foxconn Technology Group, a global electronics manufacturing leader, seeks a Process Improvement Engineer to drive operational reliability and product quality by leading BGA rework equipment programming, maintenance protocols, and Control-run-managed process optimization. Responsibilities include standard operating procedure standardization, yield-driven problem resolution, client inquiry management, FACA analysis reporting, and PDCA-driven improvements to eliminate defects and boost repair efficiency.

Duties

and Responsibilities

Dynamically adjust BGA rework equipment parameters based on product requirements to ensure precision, and validate equipment stability in real-time.

Perform BGA device cleaning, component inspections, and preventive maintenance, document anomalies, and drive rapid fixes to avoid downtime.

Design standardized workflows for diverse components and validate feasibility through hands-on testing.

Analyze Control-Run project yield data and bottlenecks, implement improvement plans, and align outputs with customer specifications.

Aggregate monthly PDCA results (e.g., efficiency gains, cost optimizations), analyze gaps, plan next steps, and communicate progress to clients to address technical queries, ensure compliance, and strengthen trust.

Adhere to company policies and Standard Operating Procedures in all operational workflows.

Education and work experience

Successful completion of 4-years of high school, or equivalent, plus completion of 4 years of college with a bachelor’s degree, plus attainment of a master’s degree. Degree required:
Electrical Automation Engineering

3 to 8 years of experience in Automation, Mechanical Engineering, or Electronics sectors

Working conditions

Modern, collaborative offices or labs with flexible setups emphasizing innovation and teamwork.
Employees are continuously encouraged to learn and grow their careers in smart manufacturing.

Skills

End-to-end electronics manufacturing expertise with hands-on SMT assembly and wave soldering optimization to resolve production bottlenecks and drive process efficiency.

Proficiency in SMT IPC standards and PCB manufacturing processes to design quality-driven solutions, ensure compliance, and optimize production workflows.

Languages Spoken and Proficiency Level;
Please list all languages you speak and indicate your proficiency level for each (e.g., Basic, Conversational, Professional, Native/Fluent).

The following questions are entirely optional.

Invitation for Job Applicants to Self-Identify as a U.S. Veteran

A “disabled veteran” is one of the following:
- a veteran of the U.S. military, ground, naval or air service who is entitled to compensation (or who but for the receipt of military retired pay would be entitled to compensation) under laws administered by the Secretary of Veterans Affairs; or
- a person who was discharged or released from active duty because of a service-connected disability.
A “recently separated veteran” means any veteran during the three-year period beginning on the date of such veteran's discharge or release from active duty in the U.S. military, ground, naval, or air service.
An “active duty wartime or campaign badge veteran” means a veteran who served on active duty in the U.S. military, ground, naval or air service during a war, or in a campaign or expedition for which a campaign badge has been authorized under the laws administered by the Department of Defense.
An “Armed forces service medal veteran” means a veteran who, while serving on active duty in the U.S. military, ground, naval or air service, participated in a United States military operation for which an Armed Forces service medal was awarded pursuant to Executive Order 12985.

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Expires 04/30/2026

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