Microelectronic Packaging Technical Lead Project Engineer

Microelectronic Packaging Technical Lead Project Engineer

Company:

The Boeing Company

The Boeing Company is currently seeking a Microelectronic Packaging Technical Lead Project Engineer to join our Secure Computing Solutions team. This position will focus on supporting the Boeing Defense, Space & Security (BDS) business organization.

As a Microelectronics Packaging Project Engineer at Boeing, you will be part of a collaborative, multi-disciplinary team which develops leading-edge cyber, ARM-based System On Chip (SoC) solutions.

• Lead project coordination and management for the microelectronic packaging team to support the development and delivery of processor packaging solutions, including 3D advanced packaging, ensuring alignment, schedule adherence, and effective communication across teams
• Collaborates across a cross-functional team of processor design engineers, electronic circuit board design engineers, test engineers, field application engineers, firmware/software engineers, supplier management, program management, and others to ensure alignment of the package throughout the development lifecycle
• Leads project execution throughout the program lifecycle, including completing and managing the statement of work, tracking progress, and defining performance metrics to ensure successful delivery
• Coordinates the packaging team’s trade studies and source selection process to ensure effective collaboration and timely, informed decisions aligned with project objectives.
• Oversees the identification and management of risks, issues, and opportunities to protect the project’s objectives and drive successful delivery.
• Plans, identifies, and coordinates the necessary resources throughout the project or program lifecycle to ensure timely and efficient execution.
• Monitors actual results against the baseline plan—including cost and schedule—to evaluate project performance, identify efficiencies, and capture lessons learned.
• Provides leadership in project integration and execution by aligning technical and business objectives and supporting the development of project and team plans.

This position is expected to be 100% onsite. The selected candidate will be required to work onsite at one of the listed locations.

Travel may be required up to 10% of the time;
Domestically and/or internationally depending on business needs.

This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim/Final U.S. Secret Clearance Post-Start is required.

This position requires ability to obtain Special Program Access, for which the U.S. Government requires U.S. Citizenship only.

• Bachelor of Science degree in Engineering, Engineering Technology (including Manufacturing Technology), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
• 9 or more years’ related work experience or an equivalent combination of technical education and experience
• Ability to lead the team to develop the following documentation: trade studies, supplier statement of work, supplier quality statement of work and reviews (Supplier Requirements Review, Preliminary Design Review, Critical Design Review, Manufacturing Verification Process Review, etc).
• Ability to collaborate and work with suppliers
• Excellent analytical, written and verbal interpersonal skills and ability to work as part of a diverse team
• Excellent presentation skills including adapting to the audience: executive, industry, customers and diverse cross-disciplinary junior engineers
• Excellent MS Word, Excel and PowerPoint skills

• Led a…