Radar Electronics Packaging Design Mechanical Engineer

Leidos’ Ground Based Radar Digitization (GBRD) program is seeking an experienced mechanical engineer to design structural packaging for electronics components within a large radar system. This is a large, multi‑phase radar program with concurrent development, test, production, and sustainment activities. As a member of the radar back‑end processing team, you will be responsible for the mechanical design aspects associated with component selection, electronics rack sizing, shock isolation, layout, mounting, cable routing, and cooling solutions.

• Support and lead mechanical engineering tasks for design, analysis, manufacture, and emplacement of new digitized radar system back‑end processing solution
• Perform technical trade studies
• Apply sound engineering practices to develop concepts using CAD and mature designs that meet system requirements
• Support technical peer, table‑top, and internal/external design reviews
• Create and maintain Technical Data Package (TDP) artifacts, including CAD models, drawings, bills of materials, and specifications
• Communicate and collaborate effectively with design, analysis, and fabrication teams to resolve challenges

• Bachelor’s degree in Mechanical or Aerospace Engineering from an ABET‑accredited university
• BS + 4 years progressive engineering experience, or MS + 2 years
• Proficient with structural design via CAD tools such as Solid Works, Creo, CATIA, or AutoCAD
• Experience with drawing generation in accordance with ASME Y14.100 & Y14.5
• Basic understanding and application of GD&T (ASME Y14.5) and tolerance stack‑up analysis
• Strong attention to detail, analytical thinking, and problem‑solving skills
• Excellent communication and collaboration skills
• Self‑starter with ability to work independently and in team environments
• Proficiency with Microsoft Office applications (Word, Excel, PowerPoint)
• Active DoD security clearance (or eligibility to obtain)

• Solid Works experience
• Windchill experience
• Basic understanding or experience with radars or other advanced sensing technologies
• Experience with electronics packaging, server racks, and cable routing
• Experience with electronics and server room thermal solutions
• Experience with technical data and documentation release and management in Windchill
• Experience supporting rapid development, prototyping, or fast‑paced engineering programs
• Knowledge of MIL‑STD‑31000 Technical Data Package (TDP) development
• Active DoD security clearance

All qualified applicants will receive consideration for employment without regard to sex, race, ethnicity, age, national origin, citizenship, religion, physical or mental disability, medical condition, genetic information, pregnancy, family structure, marital status, ancestry, domestic partner status, sexual orientation, gender identity or expression, veteran or military status, or any other basis prohibited by law. Leidos will also consider for employment qualified applicants with criminal histories consistent with relevant laws.