PCB Design Engineer – HDI Multilayer

PCB Design Engineer, High Speed Multilayer Systems

Huntsville, AL $100,000 to $140,000 per year

This employer is part of a larger global technology organization and is a recognized leader in rugged, open architecture embedded computing for defense, aerospace, and industrial markets. The team designs complex, high-density printed circuit boards supporting next generation embedded computing platforms for military, industrial, and scientific applications.

Schedule:

Full time, direct hire position based in Huntsville, AL. Travel is minimal.

Compensation: $100,000 to $140,000 per year, based on experience and qualifications.

As a PCB Design Engineer, you will design complex, high density multilayer PCBs (typically 14 to 24 or more layers), owning stack-up construction, via technology (blind, buried, and microvia), and routing strategy using both manual and auto-assisted techniques. You will translate schematics into manufacturable layouts for high speed digital interfaces including DDR4/DDR5, GDDR, PCI Express Gen4/Gen5, Gigabit and high speed Ethernet, Fibre Channel, and Ser Des, working closely with electrical, FPGA, mechanical, and signal integrity engineers through design reviews, fabrication documentation, and DFM/DFA/DFT release.

• Bachelor's degree in Electrical Engineering, Electronic Engineering, or related discipline, or equivalent experience
• 2+ years of professional PCB layout experience, with Siemens EDA Xpedition (Layout and DxDesigner) strongly preferred
• Strong background in high speed digital PCB design: DDR4/DDR5, GDDR, PCIe Gen4/5, Gigabit/high speed Ethernet, Fibre Channel, Ser Des, controlled impedance and differential pair routing
• Experience with HDI technologies (blind/buried vias, via-in-pad, sequential lamination, microvias) and dense multilayer stack-ups
• Hands on experience with BGA, fine pitch BGA, QFN, high pin count FPGA layouts, and rigid or rigid-flex designs
• Strong understanding of signal integrity, power integrity, DFM, DFA, and DFT principles
• Experience creating fabrication, assembly, and manufacturing documentation
• Must be a U.S. Citizen or Green Card holder (visa sponsorship is not available for this role)

• Experience migrating designs from Altium, Cadence Allegro, OrCAD, PADS, Zuken, or PCAD into Xpedition
• Experience with RF, analog, mixed signal, and FPGA based PCB layouts
• Experience designing for aerospace, defense, space, radar, or other mission critical applications
• Working knowledge of IPC standards and military specifications
• Experience mentoring PCB designers or establishing design methodologies
• Ability to leverage AI assisted engineering tools while validating engineering accuracy

Compensation and Benefits:
Salary range of $100,000 to $140,000 per year, plus annual performance incentives. Medical, dental, and vision insurance. 401(k) retirement plan with company contribution. Paid time off and paid holidays. Career development and technical training opportunities.

To apply, submit your resume for consideration.