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Strategic Student Program: Electronics Software Engineering Intern - Digital Component Specifications; EBS

Job in Huntsville, Madison County, Alabama, 35824, USA
Listing for: Siemens Mobility
Full Time, Part Time, Apprenticeship/Internship position
Listed on 2026-09-12
Job specializations:
  • Software Development
    Software & AI Developer Internship, Software Testing, Java Developer
Salary/Wage Range or Industry Benchmark: 41000 - 69000 USD Yearly USD 41000.00 69000.00 YEAR
Job Description & How to Apply Below

Strategic Student Program:
Electronics Software Engineering Intern - Digital Component Specifications (EBS, Spring 2027)

520645

04-Sep-2026

Internal Services

Siemens Industry Software Inc.

Temporal

Siemens Industry Software Inc.

Strategic Student Program (SSP)

Discover your career with us at Siemens Industry Software!

We are a leading global software company dedicated to the world of computer aided design, 3D modeling and simulation— helping innovative global manufacturers design better products, faster! With the resources of a large company, and the energy of a software start-up, we have fun together while creating a world class software portfolio. Our culture encourages creativity, welcomes fresh thinking and focuses on growth, so our people, our business, and our customers can achieve their full potential.

We’re currently recruiting students for our Spring 2027 Strategic Student Program. Our intern and co‑op positions will allow you to find a career path that most inspires you. Here, you will apply your education to solve real‑world problems and turn theory into practice. At Siemens, our goal is to empower our students to become the next leaders of our company.

Baseline Requirements:

  • Currently enrolled as a university student (undergraduate or graduate) in their Sophomore year or above.
  • Available to work part‑time starting Spring 2027
  • Authorized to work in the United States without the need for current or future sponsorship by the company
  • Potential for full‑time offers after university graduation and completion of the program
  • Mentorship from senior engineers
  • Individual career development planning
  • Networking with our global leaders
  • Professional and technical workshops
  • Leadership opportunities
  • Energetic student community
  • Employee discounts at our top customer sites

Electronics Software Engineering Intern – Digital Component Specifications

Opportunity Type:

Paid Internship

Location(s):

Position Type:

Electronics Software Engineering Intern

Major/Concentration:

Electrical, Computer, Electronics, or Software Engineering with electronics coursework

GPA:

3.8 or higher required

Description

Siemens Digital Industries Software is seeking an intern with strong software skills and a solid electronics foundation. The intern will help develop Java‑based software and XML data models that digitally represent microelectronics component specifications. This work requires the ability to understand component terminology, datasheet content, electrical properties, and engineering constraints so the software accurately reflects the electronics domain.

What You Will Do

  • Develop, test, debug, and document software features using Java and related technologies.
  • Work with XML schemas and structured data used to digitally represent microelectronics component specifications.
  • Translate electronics datasheet concepts, component properties, and microelectronics terminology into reliable software behavior.
  • Develop, test, debug, and document software features using Java and related technologies.
  • Work with XML schemas and structured data used to digitally represent microelectronics component specifications.
  • Translate electronics datasheet concepts, component properties, and microelectronics terminology into reliable software behavior.

What We Are Looking For

  • Currently pursuing a degree in Electrical Engineering, Computer Engineering, Electronics Engineering, or Software Engineering with electronics coursework.
  • Foundational programming experience in Java or another object‑oriented programming language.
  • Coursework in electronics, microelectronics, circuits, semiconductor devices, embedded systems, or electronic component datasheets.
  • Strong academic performance with a GPA of 3.8 or higher.
  • Interest in digital component models, engineering data standards,…
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