College Grad - Process Engineer, APTD Bonding

New College Grad
- Staff Process Engineer, APTD Bonding at Micron USA Inc is a role located in Idaho City, United States. The position focuses on starting up, developing and optimizing bonding processes in semiconductor manufacturing, with responsibilities in process yield improvement, cost reduction, productivity improvement, risk management, and resolving line problems.

• Identify, diagnose and resolve assembly process related problems.
• Coordinate and execute process, equipment and material evaluation and optimization initiatives, implementing changes at each process step.
• Lead or participate in continuous yield improvement and cost reduction activities.
• Validate and fan out new process baseline qualification, including new process, tools and/or materials for new product introduction.
• Support SPC/FDC/RMS/APC processes.
• Support site-to-site portability.
• Manage and audit material suppliers to achieve quality, cost and risk management objectives.
• Support internal and external audits.

• MS degree in Material Science, Electrical Engineering, Mechanical Engineering or any other relevant technical degree.
• PC skills including Microsoft Office (PowerPoint, Word, Excel, One Note) and a good understanding of Micron AI tools.
• Experience in developing and maintaining processes on semiconductor equipment.
• Ability to prioritize and work independently.

• Industry or R&D experience specific to wafer-level processing and wafer inspect methodologies.
• PhD Degree in Material Science, Electrical Engineering, Mechanical Engineering or any other relevant technical degree.
• Experience in developing and maintaining processes on semiconductor equipment.

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a range of medical, dental and vision plans, income protection if you are unable to work due to illness or injury, paid family leave, robust paid time‑off and paid holidays. For additional information regarding the benefit programs available, please see the Benefits Guide posted on

Micron is proud to be an equal‑opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

• Company: Micron USA Inc
• Position: New College Grad
  - Staff Process Engineer, APTD Bonding
• Work Location: Idaho City
• Country: US