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New Grad Process Engineer, APTD Bonding

Job in Idaho City, Boise County, Idaho, 83631, USA
Listing for: Micron USA Inc
Full Time position
Listed on 2026-06-26
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 70000 - 90000 USD Yearly USD 70000.00 90000.00 YEAR
Job Description & How to Apply Below
Position: New Grad Staff Process Engineer, APTD Bonding
Location: Idaho City

Micron USA Inc is hiring for a New College Grad - Staff Process Engineer, APTD Bonding position located in Idaho City, United States. The role involves developing and optimizing bonding processes in semiconductor manufacturing, focusing on process yield improvement and risk management.

Candidates should have a relevant MS or PhD degree and strong PC skills, including Microsoft Office. The position offers comprehensive benefits, including medical, dental, and paid time off.

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