More jobs:
New Grad Process Engineer, APTD Bonding
Job in
Idaho City, Boise County, Idaho, 83631, USA
Listed on 2026-06-26
Listing for:
Micron USA Inc
Full Time
position Listed on 2026-06-26
Job specializations:
-
Engineering
Process Engineer, Manufacturing Engineer
Job Description & How to Apply Below
Location: Idaho City
Micron USA Inc is hiring for a New College Grad - Staff Process Engineer, APTD Bonding position located in Idaho City, United States. The role involves developing and optimizing bonding processes in semiconductor manufacturing, focusing on process yield improvement and risk management.
Candidates should have a relevant MS or PhD degree and strong PC skills, including Microsoft Office. The position offers comprehensive benefits, including medical, dental, and paid time off.
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