R&D Application Engineer III

Mac Dermid Alpha Electronics Solutions, a business segment of Element Solutions Inc (NYSE: ESI), is renowned worldwide for its commitment to revolutionizing the electronics industry. With a legacy spanning over a century, we have continually set new benchmarks for excellence, reliability, and sustainability in electronic materials.

• Wafer Level Packaging – Revolutionizing wafer fabrication processes for enhanced efficiency and performance
• Circuitry Solutions – Tailored solutions to meet the dynamic demands of modern circuitry
• Electronics Assembly Solutions – Innovating semiconductor, surface mount technology, and power electronics assembly for unparalleled reliability
• Advanced Materials and Joining – Engineering polymer and metal joining solutions for optimally performing circuits
• Film & Smart Surface Solutions – Transforming electronics with cutting‑edge materials and technologies for enhanced functionality and reliability
• Micromax – Elevating electronics through high-performing, specialized inks and pastes

Across diverse sectors including automotive, consumer electronics, mobile devices, telecom, data storage, infrastructure, and AI, Mac Dermid Alpha Electronics Solutions has earned the trust of manufacturers worldwide. Our comprehensive range of high-quality solutions and technical services enables the entire electronics supply chain, empowering businesses to thrive in today's competitive landscape.

We embody the 'Elements of our Culture'—our five C's:
Challenge, Commit, Collaborate, Choose, and Care. These core values form the foundation of our organization and are embraced by employees in interactions with customers, colleagues, and stakeholders, driving financial performance and creating a rewarding work environment.

We are seeking a technically strong and customer‑focused Application Engineer who can bridge the gap between product technology and real‑world customer applications. With hands‑on technical expertise, the ability to understand complex application processes, and a passion for helping customers achieve the best performance from our products. With the ability to thrive in environments where innovation, problem‑solving, and technical collaboration are at the forefront.

This position is highly laboratory‑focused, spanning test method development, DOE‑driven process optimization, reliability testing, and failure analysis. Your responsibilities will include:

Technical Support & Problem Solving

• Support development, validation, and optimization of next‑generation electronic materials, including advanced die attach solutions and sintered nanomaterials.
• Troubleshoot issues faced by customers during or post new product introduction (NPI) stage.
• Conduct failure mode analysis, identify defects and material‑related issues, and recommend improvements.

Application Testing & Process Development

• Perform product evaluations, trials, and performance testing.
• Support sample build campaigns by designing builds and commissioning for production using specialized tools.
• Optimize application processes and conditions or product usage guidelines.
• Prepare technical reports, test summaries, and recommendations.

Customer Engagement

• Conduct field trials or on‑site customer testing.
• Translate customer needs into technical requirements for internal teams.

Cross Functional Collaboration

• Work closely with R&D, customer technical support, sales, and product management to support new product introductions and technical projects.

Instrument Skills

• Operate and manage laboratory application process equipment including screen printers, pick‑and‑place machines, reflow ovens, sinter presses, environmental test chambers, die shear machines, and electrical probing systems.
• Perform periodic maintenance on assigned equipment to ensure optimal working conditions.

• B.E. / MSc / M.E. / MTech in Electronics, Materials Science, Nanotechnology, Physics, or related fields.
• 5+ years of experience in semiconductor assembly or materials‑based application process development.
• Experience with die attach or advanced packaging preferred.

• Strong analytical thinking and…