Construction Analysis Engineer Job Indiana Borough area,Pennsylvania USA,Engineering

Are you looking for an exciting, innovative company with over 100 years of excellence and commitment to ethical business? Are you a motivated Electronics Technician looking for a new role? Amentum is a trusted partner to United States government agencies, allied governments, and corporations worldwide and we are looking for you to support our Strategic Microelectronics program as Construction Analysis Lab mechanical engineer.

You might be just who we are looking for!

We are seeking a driven, hands-on engineer/technician with practical experience in microelectronics to develop, lead, and support physical construction analysis of simple and complex microelectronic components. Devices that may be analyzed include fully populated circuit card assemblies (CCAs), electronic packaging, hybrid devices, semiconductor devices, and electromechanical devices. The successful candidate will be responsible for a wide variety of electrical, environmental, and mechanical instrument development of test plans, execution of testing, and analysis, summary, and customer presentation of results.

The contractor shall support electronic part testing and analyses per the applicable MIL-STDs or test specifications.

Job Duties and Responsibilities:

Technical oversite of construction analysis
Instrument ownership and capability development
Establish, develop and maintain construction analysis test programs
Provide technical oversight for test data and procedures
Development of standard operating procedures and test plans
Development of quantitative and semi-quantitative methods for emergent, non-standard requests
Data analysis, reporting, and communication
Interpret construction analysis data providing clear technical conclusions
Prepare and review reports and presentations for customers/stakeholders
Maintain organized records of testing
Communicate results to both technical and non-technical audiences
Work independently or collaboratively on projects as needed

Required Qualifications:

The successful candidate will demonstrate working knowledge of

Microelectronic packaging including chip, package, and CCA level construction and fabrication techniques
Working knowledge of destructive and non-destructive construction analysis techniques including 2D and CT X-ray, acoustic microscopy, optical microscopy, scanning electron microscopy (SEM), particle impact noise detection (PIND), physical dimensioning, x-ray fluorescence (XRF), fine and gross leak testing, residual gas analysis (RGA), solderability, bond pull, die shear, and similar techniques
Working knowledge of relevant MIL-STDs including MIL-STD-750, MIL-STD-202, MIL-STD-883, MIL-STD-981, and MIL-STD-1580
Mechanical, electrical, and environmental instrument operation, calibration and performance verification for construction analysis testing
Method development and optimization for construction analysis testing
Working knowledge of industry standards pertaining to the test and evaluation of microelectronic components
Working knowledge of basic electrical engineering and materials engineering relevant to microelectronic construction analysis

Candidate must have these abilities and skills:

Effective technical communication between peer engineers, scientists, and technicians and external and internal customers
Rigorous and succinct summarization of technical results in a formal, written report using MS Word and MS Power Point
Generate and review document procedures, follow documented procedure
Sufficient level of software and programming tools:
MATLAB or python for advanced data analytics
Image processing experience for simple registration using ImageJ or similar tool
CAD experience for simple fixture design (Solid Works or equivalent)
Work independently and collaboratively within cross-functional teams
Deductive reasoning necessary to interpret how individual test results apply to a larger data package
Laboratory and test skills necessary to perform rigorous tests and evaluations using analytical equipment
Ability to adapt MIL-STD and industry standard test and evaluation methods to the specific needs of a technical project
Mechanical design and fabrication of simple test fixtures for microelectronic testing
Present technically challenging information to a diverse audience in a succinct way that allows full audience to understand key take aways from the material presented

Must have:

Bachelor’s degree in mechanical engineering or mechanical engineering technology and two years' relevant experience
Must have the ability to obtain and maintain a U.S. Government Secret Clearance. Please note U.S. Citizenship is required to obtain a Secret Clearance.

Preferred Requirements:

Prior DoW experience
Active Secret Clearance
SCALE program affiliate

Compensation Details:

$80,000-$155,000 annually

The compensation range or hourly rate listed for this position is provided as a good-faith estimate of what the company intends to offer for this role at the time this posting was issued. Actual compensation may vary based on factors such as job…