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Lead Packaging Architect .5D​/3D ICs

Job in Irvine, Orange County, California, 92713, USA
Listing for: Broadcom Inc.
Full Time position
Listed on 2026-06-01
Job specializations:
  • Engineering
    Systems Engineer, Packaging Engineer
Salary/Wage Range or Industry Benchmark: 91000 - 146000 USD Yearly USD 91000.00 146000.00 YEAR
Job Description & How to Apply Below
Position: Lead Packaging Architect for 2.5D/3D ICs

Broadcom Inc. is seeking a talent in advanced packaging design with hands-on experience in GDSII-based physical layout. The role involves architecting advanced packaging solutions and defining design rules for new technology.

Qualifications include a Bachelor’s degree in Engineering with 5+ years of experience or a Master’s degree with 3+ years. The position offers a competitive salary range of $91,000 – $146,000 along with a comprehensive benefits package.

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