Senior VLSI Physical Design Engineer

Xcelerium is a fabless semiconductor company developing advanced edge processors that bring AI processing to high-bandwidth sensors and wireless devices, unlocking hidden insights from every RF signal.

Working at Xcelerium will provide an opportunity to work on a complex development from the ground up and become familiar with cutting edge technologies such as the wireless signal processing, computer vision, sensor fusion, machine learning and inner workings of frameworks such as Tensor Flow, PyTorch, OpenCL and OpenGL, etc. In addition, the application domains will be 5G, UAVs/Drone, Robots, and Autonomous Vehicles which provide enormous scope for growth and making an impact.

We are seeking a highly skilled Senior SoC/ASIC Physical Design Engineer to lead and drive the physical design activities to successful closure by collaborating closely with RTL and other cross-functional engineering teams. You will be responsible for developing, refining and implementing cutting-edge flows and methodologies that optimize design performance, power efficiency, and area (PPA). Your expertise will directly contribute to achieving world-class time-to-closure and tapeout with optimal team size and resources.

• Develop and Implement PD Flow: Establish a modern physical design (PD) flow utilizing the latest EDA tool fusion and machine learning (ML) techniques to maximize PPA efficiency, optimize resource allocation, and achieve industry-leading time-to-closure and tapeout.
• End-to-End Physical Design Execution: Perform partition synthesis and physical implementation, including synthesis, floor planning, power/ground grid generation, place & route, timing, noise, physical verification, electromigration, voltage drop, and signoff checks.
• Methodology and Automation: Create and refine physical design methodologies and automation scripts to streamline implementation and signoff processes.
• Cross-Functional Collaboration: Work closely with RTL, DFT, and ASIC design teams to define architectural feasibility, establish timing, power, and area targets, and explore design trade-offs.
• Drive Design Closure: Utilize an objective, metrics-driven approach to resolve design, timing, and flow issues and ensure predictability in achieving project milestones.
• Signoff Ownership: Lead signoff closure activities, including static timing analysis (STA), noise analysis, logic equivalency, physical verification, and power integrity (EM/IR).

Education:

Bachelor’s degree in Electrical Engineering, Computer Engineering, or Computer Science (Master’s preferred).

• Experience: 10+ years of experience in ASIC/SoC physical design and flow development.
• Technical Proficiency:
  • Expertise in RTL-to-GDSII physical design and signoff flows.
  • Strong experience with Synopsys EDA tools, understanding tool capabilities and underlying algorithms.
  • Proficient in physical design methodologies: synthesis, place & route, STA, formal verification, CDC, and power analysis.
  • Knowledge of FinFET and deep sub-micron CMOS technologies, including power dissipation, leakage, and dynamic behavior.
  • Familiarity with DFT, Scan, MBIST, and LBIST methodologies and their impact on physical design.
• Scripting and Automation: Proficient in scripting languages (Python, Tcl, Perl, bash/csh) and automation using Makefiles.
• Analytical Skills: Skilled in extraction and analysis of design parameters, QOR metrics, and implementing voltage scaling (SVS, DVFS) and SRAM split rail architectures.
• Team Collaboration: Proven ability to work collaboratively in dynamic environments, lead design closure activities, and drive execution with a proactive, solution-oriented mindset.

We provide competitive compensation package