Sr. IC Package Design Engineer; Silicon Engineering
Listed on 2026-06-28
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Engineering
Test Engineer, Electronics Engineer, Systems Engineer, Electrical Engineering
SR. IC PACKAGE DESIGN ENGINEER (SILICON ENGINEERING)
We are seeking a motivated, proactive, and intellectually curious engineer who will work alongside world‑class cross‑disciplinary teams (systems, firmware, architecture, design, validation, product engineering, ASIC implementation). In this role, you will develop cutting‑edge next‑generation ASICs for deployment in space and ground infrastructures around the globe. These chips enable connectivity in places that has previously not been available, affordable or reliable. As an IC Package Design Engineer, you will be an integral part of the IC design team and lead packaging for custom in‑house ASICs and RFICs for digital beam formers and modems.
RESPONSIBILITIES- Own and drive advanced package selection, new product BGA configuration and package structure
- Responsible for package/SIP layout, optimization, design verification and tapeout
- Interface and coordinate with cross‑functional groups throughout the company on new product package selection, feasibility analysis and design
- Work cross‑functionally, understand trade‑offs, constraints, and optimize silicon floor plan, bump and package pin‑out
- Simulate and optimize signal/power integrity and RF performance of the package design
- Drive methodology, innovations, and productivity improvements in package design
- Bachelor's degree in electrical engineering, computer engineering, or physics
- 5+ years of experience with IC package design
- Experience with Co‑packaged Optics (CPO)
- Thorough understanding of signal and power integrity fundamentals
- Substrate design experience for RF, digital, high‑speed and mixed signal die
- Experience with Cadence APD+/SIP or similar design tools
- Experience in package design electrical review, SI/PI analysis
- Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, ADS
- Experience in package design for manufacturing reviews
- Familiar with BGA package substrate technologies
- Strong problem solving skills with strong engineering fundamentals
- Ability to work extended hours or weekends as needed to meet mission‑critical deadlines
Pay range: RF Engineer/Senior: $ - $ per year。
Your actual level and base salary will be determined on a case‑by‑case basis and may vary based on the following considerations: job‑related knowledge and skills, education, and experience.
Base salary is just one part of your total rewards package at the company. You may also be eligible for long‑term incentives, in the form of company stock, stock options, or long‑term cash awards, as well as potential discretionary bonuses and the ability to purchase additional stock at a discount through an Employee Stock Purchase Plan. You will also receive access to comprehensive medical, vision, and dental coverage, access to a 401(k) retirement plan, short & long‑term disability insurance, life insurance, paid parental leave, and various other discounts and perks.
You may also accrue 3 weeks of paid vacation and will be eligible for 10 or more paid holidays per year. Exempt employees are eligible for 5 days of sick leave per year.
- To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.
The company is an Equal Opportunity Employer; employment with the company is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
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