IC Thermal Mechanical Engineer

About the Role

This role focuses on the mechanical design and thermo-mechanical simulation of complex, advanced semiconductor packages used in high-performance computing (HPC), AI, and networking products. As an IC Package Engineer, you will leverage advanced multiphysics simulations to optimize reliability, ensure high product yield, and resolve manufacturing challenges from early product definition through New Product Introduction (NPI). This position offers a dynamic balance: 70% advanced simulation and modeling work, and 30% hands‑on lab experiments in reliability testing (e.g., Electromigration, Temperature Cycling [TCT], and drop tests).

• Advanced Simulation & Modeling (70%): develop, perform, and validate advanced numerical Finite Element Analysis (FEA) and multiphysics models to evaluate package stress, strain, deformation, warpage, thermal cycling, and delamination.
• Physics‑Driven Design: apply an in‑depth understanding of structural mechanics, fluids, and heat transfer to solve complex chip‑package and package‑board interaction challenges.
• Workflow Automation: streamline simulation workflows by developing reusable model‑generation, post‑processing, design‑of‑experiments (DOE), and reliability‑data‑analysis tools (Ansys APDL, Python, or MATLAB), and leveraging Machine Learning, Generative AI, and numerical tools to build automated user interfaces.
• Empirical Reliability Lab Work (30%): conduct and oversee hands‑on reliability lab testing to investigate package failure mechanisms and utilize experimental data to define and predict overall product reliability.

• Bachelor's degree with 8+ years of relevant industry experience; or a Master's degree with 6+ years; or a PhD with 3+ years of experience in Mechanical Engineering, Material Sciences, or a related field with an emphasis on solid mechanics.
• Deep understanding of electronic packaging structures and advanced materials.
• Ability to evaluate complex numerical simulations against first principles (e.g., strength of materials solutions).
• Working knowledge of electromigration and general silicon/IC packaging reliability.
• Hands‑on expertise with major Finite Element Method (FEM) tools, specifically ANSYS (Classic/Mechanical).
• Strong capability in Ansys APDL, MATLAB, and Python.

• Experience supporting electromigration assessments by developing accelerated testing for package‑level interconnects (including BGA balls, C4 bumps, Cu pillars, microbumps and metallization structures) and partnering with failure‑analysis teams to identify root causes of degradation.
• Hands‑on experience performing mechanical testing and utilizing experimental material characterization metrologies (e.g., DMA/TMA, nano‑indentation).
• Previous thermal engineering background utilizing tools such as Icepak and Flotherm.
• Experience integrating Machine Learning and Gen‑AI applications into engineering workflows.

The annual base salary range for this position is USD  to USD . As a valued member of our team, you will be eligible for a discretionary annual bonus and the opportunity to receive a competitive new hire equity grant, as well as annual equity awards, all subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package including medical, dental and vision plans; 401(K) participation with company matching;
Employee Stock Purchase Program;
Employee Assistance Program; company paid holidays; paid sick leave and vacation time; and other leaves of absence. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal‑opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.